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Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair
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13546.

Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair Open Details in New Window [Sep 18, 2025]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-K/CMOS Wafer Laser Grooving Cutting Machine
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13547.

Low-K/CMOS Wafer Laser Grooving Cutting Machine Open Details in New Window [Sep 18, 2025]

Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Guaranteed Quality Semiconductor Debonding Machine with Strong Wear Resistance
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13548.

Guaranteed Quality Semiconductor Debonding Machine with Strong Wear Resistance Open Details in New Window [Sep 18, 2025]

Product Description features Automatic glue remover also known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ...
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13549.

Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automated Production Sic / Si Laser Wafer Internal Modification Machine
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13550.

Automated Production Sic / Si Laser Wafer Internal Modification Machine Open Details in New Window [Sep 18, 2025]

Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Frame Laser Barcode Engraving Machine with Secs-Gem Communication Networking ...
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13551.

Fully Automatic Frame Laser Barcode Engraving Machine with Secs-Gem Communication Networking ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection Vision recognizes laser printed 2D codes Automatic generation of Mapping data SECS-GEM ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine
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13552.

Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine Open Details in New Window [Sep 18, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
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13553.

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser Open Details in New Window [Sep 18, 2025]

Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
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13554.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Open Details in New Window [Sep 18, 2025]

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production
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13555.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Open Details in New Window [Sep 18, 2025]

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Product Description Laser Internal modification machine for lt/ln wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

HDPE Plastic IBC Water Tank 1000L 2000L Chemical Use Making Machine
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13556.

HDPE Plastic IBC Water Tank 1000L 2000L Chemical Use Making Machine Open Details in New Window [Sep 08, 2025]

Product Description HDPE Plastic IBC Water Tank 1000L 2000L Chemical Use Making Machine This machine is specialized in making the 1000l 2000l 3000l IBC tank. The main parts of this machine are designed and ...

Company: Zhangjiagang Sino-Tech Machinery Co., Ltd.

500L 1000L 2000L IBC Tank Making Machine for Chemical Water Storage
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13557.

500L 1000L 2000L IBC Tank Making Machine for Chemical Water Storage Open Details in New Window [Sep 08, 2025]

Product Description 500L 1000L 2000L IBC Tank Making Machine for Chemical Water Storage This machine is specialized in making the 1000l 2000l 3000l IBC tank. The main parts of this machine are designed and ...

Company: Zhangjiagang Sino-Tech Machinery Co., Ltd.

Customized PE HDPE LDPE PP 30L 60L Extrusion Plastic Bottle Blow Molding Machine
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13558.

Customized PE HDPE LDPE PP 30L 60L Extrusion Plastic Bottle Blow Molding Machine Open Details in New Window [Sep 08, 2025]

Product Description Customized PE HDPE LDPE PP 30L 60L Extrusion Plastic Bottle Blow Molding Machine This machine is specialized in making the 30L to 60L water bottle. The main parts of this machine are designed and ...

Company: Zhangjiagang Sino-Tech Machinery Co., Ltd.

Manually Adjust The Lower Die of The Bending Machine
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13559.

Manually Adjust The Lower Die of The Bending Machine Open Details in New Window [Sep 04, 2025]

Product Parameters Bending Angle 30°-90° Range of regulation 25mm-400mm Plate thickness range 3-50mm Mode Manual, semi-automatic, fully automatic FAQ Welcome to Kunshan Easy Fabrication Technology ...

Company: Kunshan Easy Fabrication Technology Co.,Ltd.

Computerized Automatic Set Blow Molding 2000L Water Tank Making Machine
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13560.

Computerized Automatic Set Blow Molding 2000L Water Tank Making Machine Open Details in New Window [Aug 26, 2025]

Computerized Automatic Set Blow Molding 2000L Water Tank Making Machine Product Description STD-1000L Extrusion Blow Molding Machine Machine Features 1. Special design for 1000L PE/PP/ABS... Water tanks. 2. ...

Company: Zhangjiagang Sino-Tech Machinery Co., Ltd.