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9.52mm Aluminum Wire Bar Rod Rewinding Machine From Italy Technology Supplier in China with Price
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13726.

9.52mm Aluminum Wire Bar Rod Rewinding Machine From Italy Technology Supplier in China with Price Open Details in New Window [Mar 03, 2023]

9.52mm Aluminum Wire Bar Rod Rewinding Machine from Italy Technology supplier in China with price An aluminum rod rewinding machine is a specialized piece of equipment used in the aluminum industry to rewind ...

Company: Changzhou Optima Technology Co., Ltd.

High-Precision Automatic Laser Drilling Machine for Glass & Ceramics
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13727.

High-Precision Automatic Laser Drilling Machine for Glass & Ceramics Open Details in New Window [Mar 10, 2026]

Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Directly Sale Toilet Soap Making Machine Soap Printer Stamping Machine
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13728.

Factory Directly Sale Toilet Soap Making Machine Soap Printer Stamping Machine Open Details in New Window [Mar 13, 2026]

LAF300L-E Soap Finishing Line The LAF300 E Series, namely Economy Version, are tailor-made for small-scale startups. With simplified equipment and affordable price, it features small but profitable investment, ideally ...

Company: Nantong Sting Co., Ltd.

High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips
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13729.

High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips Open Details in New Window [Feb 28, 2026]

Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Cutting Machine for PCB and Flexible Circuits
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13730.

Precision Laser Cutting Machine for PCB and Flexible Circuits Open Details in New Window [Feb 28, 2026]

Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming
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13731.

Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming Open Details in New Window [Feb 28, 2026]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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13732.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Feb 28, 2026]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Gantry Wire Bonder Machine for Diverse Industrial Uses
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13733.

High-Precision Gantry Wire Bonder Machine for Diverse Industrial Uses Open Details in New Window [Feb 28, 2026]

Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Custom Intelligent System Wire Cut Machine EDM for Industrial Metal
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13734.

Factory Custom Intelligent System Wire Cut Machine EDM for Industrial Metal Open Details in New Window [Mar 28, 2026]

Product Parameters General Product Parameters Model BMG430A BMG530W BMG530BW BMG640W BMG640BW BMG850BW BMG1080BW Workbench Size ...

Company: Suzhou BMG Precision Machinery Co., Ltd.

Advanced Laser Processing Machines for Thin Film Solar Solutions
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13735.

Advanced Laser Processing Machines for Thin Film Solar Solutions Open Details in New Window [Mar 20, 2026]

Product Description Equipment Parameter Equipment Model HMLA03 Equipment Type Double head double light road Processing area 50x50mm-500x500mm Cut Method Cut head / vibrator Positioning ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Most Advanced Automatic Produce Machine / Wood Based Panel Machine
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13736.

Most Advanced Automatic Produce Machine / Wood Based Panel Machine Open Details in New Window [Mar 19, 2026]

Company Profile Wuxi Qiangtong Machinery Co., Ltd. was established in 2003. Till now has 18 years experience in manufacturing short cycle hot press machine for laminating melamine faced board, which is widely used ...

Company: Wuxi Qiangtong Machinery Co., Ltd.

Single Straw and Group Straw Packing Machines
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13737.

Single Straw and Group Straw Packing Machines Open Details in New Window [Mar 05, 2026]

High Speed Individual Single Straws Packing Machine Easy Operate Paper Straw Wrapping Machine Maker with eye mark tracking system Product Description The Individually Wrapping Black Paper Straws Machine is an ...

Company: Suzhou Deedo Machinery Co., Ltd.

New Type Moulded Door Skin Multi-Layers Wooden Door Press Machine
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13738.

New Type Moulded Door Skin Multi-Layers Wooden Door Press Machine Open Details in New Window [Mar 17, 2026]

Product Description Applications The DY 900~1400 series door skin hot press is used for laminating the melamine door skin, veneer door skin by moulds. The synchronizer is necessary which let the hot platens can stop ...

Company: Wuxi Qiangtong Machinery Co., Ltd.

High Precision Die Bonding Machine for PCB and IC Assembly
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13739.

High Precision Die Bonding Machine for PCB and IC Assembly Open Details in New Window [Feb 28, 2026]

Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Multi-Purpose High-Speed Fiber Laser Engraving Machine for All Materials
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13740.

Multi-Purpose High-Speed Fiber Laser Engraving Machine for All Materials Open Details in New Window [Mar 16, 2026]

Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.