Jiangsu Profile
Product List
12061. 80mic Solvent Clear Vinyl Transparent Adhesive Vinyl Solvent Printable Window Sticker Vinyl Roll 
[Sep 12, 2023]
[Sep 12, 2023] Transparent Self Adhesive Vinyl ES0812T Specifications: Surface: 80mic Glossy Clear PVC Film Glue: Clear Permanent Solvent Acrylic; Liner: 120gsm white siliconized release paper; Width: ...
12062. Factory Wholesale Price High Definition Hmc Lenses Blue Cut Lenses [Mar 22, 2026]
[Mar 22, 2026] Product Description ITEM 1.49 1.56 1.59 1.60 1.67 1.70 1.74 Single vision A A A A A A A Blue ...
12063. Wholesale Price Lens High Definition 1.56 Shmc Layers Blue Cut Lenses [Mar 22, 2026]
[Mar 22, 2026] Product Description ITEM 1.49 1.56 1.59 1.60 1.67 1.70 1.74 Single vision A A A A A A A Blue ...
12064. Qcnv Pvs14 Wide Field Assembly for Night Vision Devices Objective Eyepiece Lens [Mar 20, 2026]
[Mar 20, 2026] Company's Main Business Product Description PVS14 Objective Lens & Eyepiece This night vision objective lens component adopts a 25.1mm effective focal length design, with an F1.23 large aperture to ensure high ...
Company: Nanjing Daoce Electronics Co., Ltd.
12065. Carbon and Sulfur Analyzers Infrared Carbon-Sulfur Analyzer Measuring for Steel Materials [Mar 13, 2026]
[Mar 13, 2026] Product Description Abstract The CYY-TL8 high frequency infrared ore analyzer adopts high frequency induction furnace and infrared ore analysis system, which can quickly and accurately determine the content of carbon ...
12066. Medical Ear Rigid Ent Otoscope Endoscope Set Prices 70 Degree [Mar 05, 2026]
[Mar 05, 2026] Medical ear autoclave otoscope Product Description Discover precision and clarity with the Ouman ENT Rigid Endoscope, developed by Jiangsu Ouman Electronic Equipment Co., Ltd., a trusted manufacturer of advanced medical ...
12067. Professional Glass Cutter for Smartphone and Tablet Repairs [Mar 02, 2026]
[Mar 02, 2026] Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...
12068. High Precision Die Bonding Machine for PCB and IC Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
12069. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
12070. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
12071. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
12072. High-Precision 15W/20W UV Nanosecond Laser for Industrial Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Encapsulation in hundred class ultra clean laboratory Good beam quality(M²<1.3) High stability for long term running, 24/7 industrial application Compact structure and low power ...
12073. Advanced UV Laser Annealing Equipment for Bsi CCD Fabrication [Feb 28, 2026]
[Feb 28, 2026] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly ...
12074. Versatile Laser Engraving Equipment for PCB Fabrication Needs [Feb 28, 2026]
[Feb 28, 2026] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA ...
12075. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
