Jiangsu Profile

Product List
2806. Crystalline Powder CAS 97148-39-5 Smia for Medical Materials
[Jul 29, 2025]

Product name SMIA CAS 97148-39-5 EINECS number 405-990-1 Molecular formula C7H10N2O4 Molecular weight 186.17 Package:25KG/Bag Suzhou Senfeida Chemical Co., Ltd. is an environment-friendly high-tech ...
Company: Suzhou Senfeida Chemical Co., Ltd.
2807. Factory Supply 99% Purity Methylmagnesium Chloride (3M THF) CAS 676-58-4
[Jul 29, 2025]

Product name Methylmagnesium chloride CAS 676-58-4 EINECS number 211-629-7 Molecular formula CH3ClMg Molecular weight 74.79 Uses Methylmagnesium chloride is a widely used Grignard reagent, It is also often ...
Company: Suzhou Senfeida Chemical Co., Ltd.
2808. Medical Raw Material Methyl 2-Furoate CAS 611-13-2 with High-Purity
[Jul 29, 2025]

Product name Methyl 2-furoate CAS 611-13-2 EINECS number 210-254-6 Molecular formula C6H6O3 Molecular weight 126.11 chemical property Liquid. Boiling point 181 ºC, relative density 1.179 (22 ºC), ...
Company: Suzhou Senfeida Chemical Co., Ltd.
2809. Factory Supply 2, 2', 4, 5, 5'-Pentachlorobiphenyl CAS 37680-73-2
[Jul 29, 2025]

Product Name 2,2',4,5,5'-PENTACHLOROBIPHENYL CAS No. 37680-73-2 EINECS No. 621-393-0 Molecular formula C12H5Cl5 Appearance Clear Colourless Liquid Melting point 78ºC Boiling point 412.3°C ...
Company: Suzhou Senfeida Chemical Co., Ltd.
2810. Plastic Ziplock Bag for Packaging Flip Chip
[Jul 14, 2025]

Plastic Ziplock Bag for Packaging Flip Chip This ESD shielding bags is widely used in packing of all precise components and electronic kits which are sensitive to static. The plastic ESD bag is easy to open, ...
Company: Suzhou Sky Industrial Co., Ltd.
2811. ESD Grey Antistatic Shielding Bags
[Jul 14, 2025]

ESD Grey Antistatic Shielding Bags This ESD shielding bags is widely used in packing of all precise components and electronic kits which are sensitive to static. The plastic ESD bag is easy to open, which increases ...
Company: Suzhou Sky Industrial Co., Ltd.
2812. Packing PCB and Electrical Components ESD Bags
[Jul 14, 2025]

Packing PCB and Electrical Components ESD Bags This ESD shielding bags is widely used in packing of all precise components and electronic kits which are sensitive to static. The plastic ESD bag is easy to open, ...
Company: Suzhou Sky Industrial Co., Ltd.
2813. Industrial Absorbent Cleaning PU Sponge Brush Roller
[Jul 19, 2025]

Product Description PU roller is special urethane resin as raw materials.Widely applicable to the high precision and high quality printed circuit board, the lead frame plate production of high performance water ...
2814. PU Absorb Water Sponge Roller
[Jul 19, 2025]

Product Description PU roller is special urethane resin as raw materials.Widely applicable to the high precision and high quality printed circuit board, the lead frame plate production of high performance water ...
2815. PCB Electronic Component Industrial PU Absorbent Sponge Roller for Washing Glass
[Jul 19, 2025]

Product Description PU roller is special urethane resin as raw materials.Widely applicable to the high precision and high quality printed circuit board, the lead frame plate production of high performance water ...
2816. Industrial Machinery Use PU Foam Sponge Roller
[Jul 19, 2025]

Product Description PU roller is special urethane resin as raw materials.Widely applicable to the high precision and high quality printed circuit board, the lead frame plate production of high performance water ...
2817. Honeywell FSG15N1A Force Sensor FSG Series
[Jul 22, 2025]

The FS Series Force Sensors provide precise, reliable force sensing performance in a compact commercial grade package. The sensor features a proven sensing technology that utilizes a specialized piezoresistive ...
Company: BNSENS Co., Ltd.
2818. 1100 Polished Finish for Hand Cream Industry Tent & Decoration Use Aluminum Alloy Collapsible Tube
[Jun 26, 2025]

Specification item Aluminium Tube Place of Origin China Place of shipment Shanghai Delivery Time within 7 days Grade 1000 Series Tolerance ±10% Brand Name yiwancheng Model Number 1100 Application 1100 is generally used ...
2819. Dbc Metallization Ceramic Circuit Plated Aluminum Nitride Metallized Aln Substrate with Copper
[Jun 11, 2025]

DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. Product Description Product Name DBC Metallization Ceramic ...
2820. DMD Prepreg Paper Printed with Epoxy Resin
[May 22, 2025]

Product Description DMD Prepreg Insulating Material is a soft material formed by F-class DMD impregnated epoxy resin and then baked and semi-cured. Type: Class F DMD Prepreg Insulating Material Insulation Grade: ...
