Jiangsu Profile
Product List
27961. Customized Nylon Plastic Granules Polyamide Produce Heat Insulation Profile 
[Jul 29, 2025]
[Jul 29, 2025] Black or Customized Granule Nylon Polyamide 66 30% Glass Fiber Filled/ Polyamide 66 Pellets Flame Retardant Product Introduction: -Nylon/PA66 granules reinforced by fiberglass. The performance of final products of ...
27962. Fiber Glass Reinforced Polyamide Extrusion Grade Plastic Granules Thermal Break Profile [Jul 25, 2025]
[Jul 25, 2025] Fiber Glass Reinforced Polyamide PA66 GF25 Extrusion Grade Plastic Granules Thermal Break Strips Product Introduction -Nylon/PA66 granules reinforced by fiberglass. The performance of final products of this raw ...
27963. PA66 Polyamide Strip Extrusion Mould Nylon Plastic Extruding Die Heat Insulation Profile [Jul 25, 2025]
[Jul 25, 2025] Customized Shapes Steel Mould Plastic Extruding Molding Die for Polyamide Heat Insulation Strip Extrusion Mold Polywell mould can meet the needs of the market and customer. Polywell has its own design and ...
27964. PA66 Extrusion Mould Polyamide Thermal Break Profile Extruding Dies for Nylon Strips [Jul 25, 2025]
[Jul 25, 2025] PA66 Tubes Extrusion Mould Polyamide Thermal Break Profile Extruding Dies for Nylon Strips Production Line Polywell mould can meet the needs of the market and customer. Polywell has its own design and development of ...
27965. Plastic Granules PA66 Glass Fiber Reinforced Modified Nylon Break Bridge Profile [Jul 25, 2025]
[Jul 25, 2025] Nature Customized Color Virgin Plastic Granules PA66 Glass Fiber Reinforced Modified Nylon Compound for Break Bridge Profile Product Introduction: -Nylon/PA66 granules reinforced by fiberglass. The performance of ...
27966. High Power Semiconductor Aluminum Extrusin Heat Sink Profiles for Electronics Fanless Heatsink [Aug 04, 2025]
[Aug 04, 2025] High Power Semiconductor Aluminum Extrusin Heat Sink Profiles For Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27967. Customized Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 16, 2025]
[Jul 16, 2025] Customized Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27968. Cost Effective High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles [Jul 15, 2025]
[Jul 15, 2025] Cost Effective High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27969. 6061 6063 Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 15, 2025]
[Jul 15, 2025] 6061 6063 Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27970. OEM Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 15, 2025]
[Jul 15, 2025] OEM Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most electronic ...
27971. ISO9001 High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles [Jul 15, 2025]
[Jul 15, 2025] ISO9001 High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most electronic ...
27972. 6063 Alodined Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 14, 2025]
[Jul 14, 2025] 6063 Alodined Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27973. Zero Defected Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 10, 2025]
[Jul 10, 2025] Zero defected Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27974. High-Performance High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles [Jul 10, 2025]
[Jul 10, 2025] High-Performance High Power Semiconductor Electronics Aluminum Extrusion Heat Sink Profiles Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
27975. Smooth Surface Aluminum Extruded Heat Sinks Profile for LED Cooling [Jul 10, 2025]
[Jul 10, 2025] Smooth Surface Aluminum Extruded Heat Sinks Profile For LED Cooling Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most electronic devices ...
