Jiangsu Profile
Product List
7546. Cable Folding Labeling Machine, Cable Sticker Folded Flag Label Machine 
[Jan 13, 2022]
[Jan 13, 2022] ZCUT-430 Automatic Cable Sticker Folded Flag Label Machine Scope of application: This is a semi-automatic flag labeling machine to stick labels, bar code, etc. to cable and wire. It is widely used in electronics ...
7547. Automatic Cable Wire Folding Labeling Machine with Printer/Wire Flag Labeling Machine [Jan 13, 2022]
[Jan 13, 2022] ZCUT-430 Automatic Cable Sticker Folded Flag Label Machine Scope of application: This is a semi-automatic flag labeling machine to stick labels, bar code, etc. to cable and wire. It is widely used in electronics ...
7548. Zcut-430 Automatic Cable Sticker Folded Flag Label Machine [Jan 13, 2022]
[Jan 13, 2022] ZCUT-430 Automatic Cable Sticker Folded Flag Label Machine Scope of application: This is a semi-automatic flag labeling machine to stick labels, bar code, etc. to cable and wire. It is widely used in electronics ...
7549. Automatic Mineral Water Plastic Bottle Blow Molding Machine [Jan 13, 2022]
[Jan 13, 2022] Introduction for Linear Automatic Small PET Bottle Blow Molding Machine Linear Automatic PET Blow Molding Machine is an economical model self-developed by LiDLi technical team, with features economic, fast, convenient. ...
7550. Wmd25V Mini Drill Mill Machine [May 16, 2026]
[May 16, 2026] company head WMD25V Mini Drill Mill Compact, accurate, economical vertical drilling/mlling machine. Variable speed enables to oprerate easily. Spindle is supported by high precision taper roller bearing. Gear ...
Company: Yancheng C&J Machinery Co., Ltd.
7551. 2.5m Metal Sheet Bending Machine Manual Folding Forming Machine [May 09, 2026]
[May 09, 2026] WS series Manual Folding machine for Metal sheet Application 1Sheet metal folding machines can be used to shape metal sheets into boxes and pans in various sizes. 2 Also used for ...
7552. IC Silicon Wafer Double Side Grinding Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7553. IC Wafer Double Side Lapping Machine High Accuracy [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7554. Silicon Wafer Double Side Grinding Machine for IC Manufacturing [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7555. IC Silicon Wafer Thinning Machine High Precision [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7556. IC Wafer Thinning Machine for Semiconductor Processing [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7557. Semiconductor Silicon Wafer Grinding Machine for Clean Surface [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7558. Semiconductor Silicon Wafer Thinning Machine High Precision [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7559. Semiconductor Silicon Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
7560. Semiconductor Silicon Wafer Thinning Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
