Jiangsu Profile
Product List
8026. Press Brake Machine Plate Bending 10FT 4mm 6mm 
[Feb 27, 2021]
[Feb 27, 2021] CNC PRESS BRAKE/PLATE BENDING MACHINE 1. It adopts an all-steel welded structure with sufficient strength and rigidity. 2. It is hydraulically driven. The cylinders at both ends of the machine tool are placed on ...
Company: NANTONG HAITUO MACHINERY CO., LTD.
8027. Press Brake Machine Palte Bending Machine 6mm 2500mm [Feb 26, 2021]
[Feb 26, 2021] CNC PRESS BRAKE/PLATE BENDING MACHINE 1. It adopts an all-steel welded structure with sufficient strength and rigidity. 2. It is hydraulically driven. The cylinders at both ends of the machine tool are placed on ...
Company: NANTONG HAITUO MACHINERY CO., LTD.
8028. Press Brake Machine Plate Bending Machine 4mm 2600mm 10FT [Feb 26, 2021]
[Feb 26, 2021] CNC PRESS BRAKE/PLATE BENDING MACHINE 1. It adopts an all-steel welded structure with sufficient strength and rigidity. 2. It is hydraulically driven. The cylinders at both ends of the machine tool are placed on ...
Company: NANTONG HAITUO MACHINERY CO., LTD.
8029. Press Brake Machine Plate Bending Machine Pb 160/3200 [Feb 25, 2021]
[Feb 25, 2021] CNC PRESS BRAKE/PLATE BENDING MACHINE 1. It adopts an all-steel welded structure with sufficient strength and rigidity. 2. It is hydraulically driven. The cylinders at both ends of the machine tool are placed on ...
Company: NANTONG HAITUO MACHINERY CO., LTD.
8030. Press Brake Plate Bending Machine 100/2500 [Feb 25, 2021]
[Feb 25, 2021] CNC PRESS BRAKE/PLATE BENDING MACHINE 1. It adopts an all-steel welded structure with sufficient strength and rigidity. 2. It is hydraulically driven. The cylinders at both ends of the machine tool are placed on ...
Company: NANTONG HAITUO MACHINERY CO., LTD.
8031. Heavy-Duty CNC Milling and Boring Machine for Manufacturers [May 14, 2026]
[May 14, 2026] Product Introduction Introduction The TKX6513A is a heavy-duty horizontal boring and milling center independently developed by our company. Featuring a T-shaped moving column design with a centrally mounted spindle ...
Company: Qifa (Jiangsu) Machinery Co., Ltd.
8032. Semiconductor Wafer Lapping Machine Professional Manufacturer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8033. Semiconductor Wafer Grinding Machine for High Output Line [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8034. Silicon Wafer Double Side Grinding Machine Supplier for IC [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8035. Silicon Wafer Thinning System for IC Production [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8036. Semiconductor Silicon Wafer Thinning Machine OEM [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8037. Semiconductor Silicon Wafer Grinding Machine with PLC Control [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8038. IC Silicon Wafer Lapping Machine Exporter China [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8039. Semiconductor Wafer Double Side Grinding Equipment Supplier [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
8040. Silicon Wafer Thinning Machine for IC Production Line [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
