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Silicon Wafer Double Side Grinding Machine for IC Manufacturing
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10261.

Silicon Wafer Double Side Grinding Machine for IC Manufacturing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Thinning Equipment
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10262.

Semiconductor Silicon Wafer Thinning Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Wafer Double Side Lapping Machine High Accuracy
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10263.

IC Wafer Double Side Lapping Machine High Accuracy Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Grinding Machine CNC
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10264.

Semiconductor Silicon Wafer Double Side Grinding Machine CNC Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Thinning Machine for Semiconductor Industry
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10265.

Silicon Wafer Thinning Machine for Semiconductor Industry Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Double Side Lapping Machine for IC Processing
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10266.

Semiconductor Wafer Double Side Lapping Machine for IC Processing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Double Side Grinding Equipment
Contact Now

10267.

IC Silicon Wafer Double Side Grinding Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Polishing Machine
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10268.

Semiconductor Silicon Wafer Double Side Polishing Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Thinning Machine High Precision
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10269.

Semiconductor Silicon Wafer Thinning Machine High Precision Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Grinding Machine
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10270.

Semiconductor Silicon Wafer Double Side Grinding Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Lapping Machine Best Solution
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10271.

Semiconductor Silicon Wafer Lapping Machine Best Solution Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Precision Mini Gradient Bubble Level Tool for Accurate Measurements
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10272.

Precision Mini Gradient Bubble Level Tool for Accurate Measurements Open Details in New Window [Apr 08, 2026]

Mini Gradienter bubble level (FX-S07) Grade Industrial Dot number 2 Size 10 x 4.5 x 2 cm Precision 0.01, 1mm/5m Logo Customized laser logo Color Customized Function Wall floor ...

Company: Suzhou Foxmax Tools Co., Ltd.

60t VOD Furnace Oxygen Gun System
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10273.

60t VOD Furnace Oxygen Gun System Open Details in New Window [Apr 06, 2026]

VOD oxygen gun lifting device is composed of motor, reducer, transmission chain, bracket, guide rail, gear and oxygen gun trolley. The lifting device is installed on the lifting column fixed to the tank lid platform, ...

Company: Yangzhou Baorui Automation Technology Co., Ltd.

150t VOD Furnace Oxygen Gun System
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10274.

150t VOD Furnace Oxygen Gun System Open Details in New Window [Apr 06, 2026]

VOD oxygen gun lifting device is composed of motor, reducer, transmission chain, bracket, guide rail, gear and oxygen gun trolley. The lifting device is installed on the lifting column fixed to the tank lid platform, ...

Company: Yangzhou Baorui Automation Technology Co., Ltd.

CNC Horizontal Boring and Milling Machine for Metal Xz110 Boring Machine
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10275.

CNC Horizontal Boring and Milling Machine for Metal Xz110 Boring Machine Open Details in New Window [Mar 30, 2026]

1.INFORMATION OF CNC BORING AND MILLING MACHINE Product Description DESCRIPTION The boring and milling machine combines the processing methods of boring and milling machines, and is mainly used for boring ...

Company: Nanjing Xinzhe Cnc Machine Tool Co., Ltd.