Jiangsu Profile
Product List
4801. Sundi Special Shapes Profile Grinding Wire Sinker EDM Spark Eroded Mold Parts for Metal Stamping ... 
[Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
4802. Sundi Source Factory Press Mold Dlc Ticn Tin Coating Mold and Die Components for Maintenance of ... [Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
4803. High Quality Inner Polishing Tungsten Carbide Wear Resistant Durable Inner Deep Drawing Die [Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd
4804. Custom-Made Tin Coating Punch and Die Manufacturers Skh51 Skh61 Progressive Die Stamping Mold Parts [Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
4805. Custom Made Small Oval Precision HSS Steel Tin Stamping Die Punches Mold Accessories [Aug 19, 2024]
[Aug 19, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
4806. Diamond Saw Blade for Granite 4" to 16" Turbo Dry Cutting Disc [Dec 01, 2025]
[Dec 01, 2025] Product Description Diameter Segment Width Arbor Size Segment Height 105mm 2.2mm 22.23/20/16 7/10 110mm 2.2mm 22.23/20/16 7/10 115mm 2.2mm 22.23 7/10 125mm 2.2mm 22.23 7/10 150mm 2.4mm 22.23 7/10 180mm 2.4mm 25.4/22.23 ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
4807. Ultra Thin Hole Diamond Turbo Circular Thin Porcelain Tile Concrete Saw Blade [Dec 01, 2025]
[Dec 01, 2025] Product Description Diameter Segment Width Arbor Size Segment Height 105mm 2.2mm 22.23/20/16 7/10 110mm 2.2mm 22.23/20/16 7/10 115mm 2.2mm 22.23 7/10 125mm 2.2mm 22.23 7/10 150mm 2.4mm 22.23 7/10 180mm 2.4mm 25.4/22.23 ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
4808. Turbo Diamond Saw Blade Diamond Cutting Segmented Circular Cutting Disc [Dec 01, 2025]
[Dec 01, 2025] Product Description Diameter Segment Width Arbor Size Segment Height 105mm 2.2mm 22.23/20/16 7/10 110mm 2.2mm 22.23/20/16 7/10 115mm 2.2mm 22.23 7/10 125mm 2.2mm 22.23 7/10 150mm 2.4mm 22.23 7/10 180mm 2.4mm 25.4/22.23 ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
4809. Deep Sector Turbo Protection Teeth Diamond Circular Saw Blade with Productive Teeth [Dec 01, 2025]
[Dec 01, 2025] Product Description Diameter Segment Width Arbor Size Segment Height 105mm 2.2mm 22.23/20/16 7/10 110mm 2.2mm 22.23/20/16 7/10 115mm 2.2mm 22.23 7/10 125mm 2.2mm 22.23 7/10 150mm 2.4mm 22.23 7/10 180mm 2.4mm 25.4/22.23 ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
4810. Factory OEM 230mm Turbo Diamond Saw Blade Cutting Disc [Dec 01, 2025]
[Dec 01, 2025] Product Description Diameter Segment Width Arbor Size Segment Height 105mm 2.2mm 22.23/20/16 7/10 110mm 2.2mm 22.23/20/16 7/10 115mm 2.2mm 22.23 7/10 125mm 2.2mm 22.23 7/10 150mm 2.4mm 22.23 7/10 180mm 2.4mm 25.4/22.23 ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
4811. Multi-Station Vertical Semiconductor Wafer Dryer [Dec 13, 2025]
[Dec 13, 2025] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
4812. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
4813. Advanced Precision Laser Cutting Machines for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Quality Wafer Laser Cutting Equipment Wafer Laser Cutting Machine for Smiconductor Manufacture Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
4814. High Precision Laser Cutting System for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
4815. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
