Jiangsu Profile
Product List
10636. Ssic Sleeve Silicon Carbide Mechanical Seal Ring Ceramic Bush 
[Aug 25, 2026]
[Aug 25, 2026] High Strength Reaction Sintered SSIC Sleeve Silicon Carbide Mechanical Seal Ring Ceramic Bush with Good Tolerance Product Description Product Name Silicon carbide SiC mechanical RING Material Silicon ...
10637. Customized High Permeability Porous Diatomite Sheet Ceramic Water Filter Plate Piece [Aug 25, 2026]
[Aug 25, 2026] Product Description Product Name Diatomite Sheet Material ceramics Color white Payment T/T,Western Union,Online payment by credit card are available Application It is widely used for agricultural ...
10638. Wear Resistant Zro2 Ceramic Spot Welding Part Zirconia Location Dowel Pin [Aug 25, 2026]
[Aug 25, 2026] Wear Resistant Zro2 Ceramic Spot Welding Part Zirconia Location Dowel Pin. With excellent mechanical strength and toughness, it's the real "ceramic steel". Product Description Product Name Wear Resistant Zro2 ...
10639. High Hardness Silicon Nitride Si3n4 Ceramic Insulating Tube with Flange [Aug 25, 2026]
[Aug 25, 2026] Silicon nitride ceramic,Silicon nitride ring,Silicon nitride tube,Silicon nitride shaft,Silicon nitride ring,Silicon nitride plate,Silicon nitride sheet,Silicon nitride sleeve,Silicon nitride crucible,Silicon nitride ...
10640. Black Color Silicon Carbide Gear Bearing Bead Sic Si3n4 Grinding Balls [Aug 25, 2026]
[Aug 25, 2026] Stock Size Black Color Zro2 Gear Bearing Bead Grey White SiC Zirconia Ceramic Si3n4 Grinding Balls Product Description Material silicon carbide Size Customized Feature Wear resistance,corrosion ...
10641. No Micro Crack Picosecond Laser Cutting Machine for Photovoltaic Thin Film Cell [Sep 04, 2026]
[Sep 04, 2026] Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's UV Picosecond laser machines are industrial-grade ultrafast laser processing equipment tailored for high-end precision manufacturing. Adopting 355nm ...
10642. 355nm Wavelength UV Picosecond Laser Cutting Machine for Sapphire Ceramic Glass [Sep 04, 2026]
[Sep 04, 2026] Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's UV Picosecond laser machines are industrial-grade ultrafast laser processing equipment tailored for high-end precision manufacturing. Adopting 355nm ...
10643. Multi Material Compatible UV Picosecond Laser Cutting Machine for Glass Ceramic Metal [Sep 04, 2026]
[Sep 04, 2026] Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's UV Picosecond laser machines are industrial-grade ultrafast laser processing equipment tailored for high-end precision manufacturing. Adopting 355nm ...
10644. No Lattice Damage UV Picosecond Laser Cutting Machine for Semiconductor Chip Lead [Sep 04, 2026]
[Sep 04, 2026] Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's UV Picosecond laser machines are industrial-grade ultrafast laser processing equipment tailored for high-end precision manufacturing. Adopting 355nm ...
10645. Hot Sale Carpet Cutter Guillotine Sheet Metal Cutting Blade [Aug 25, 2026]
[Aug 25, 2026] Product Description Metallurgical knife and tools are specially designed for steel processing uses in metallurgical industry, like steel sheet, steel rod and steel bar cutting, trimming, shearing, slitting or ...
10646. Glazed Porous Alumina Ceramic Aroma Perfume Essential Oil Diffuser Rod for Car [Aug 24, 2026]
[Aug 24, 2026] Product Description Porous ceramic aroma diffuser rod Main raw materials: alumina silicon carbide powder Color: black, white, gray, beige, light green Features: can be heated, reused, large amount of aroma absorption, ...
10647. Advanced Modular Laser Annealing System for Sic Technologies [Aug 27, 2026]
[Aug 27, 2026] Hot Selling Modular Design and Integration Laser Annealing Machine for Sic Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with ...
10648. High-Precision Mopa Fiber Laser Marking System for Chips [Aug 27, 2026]
[Aug 27, 2026] Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber Laser Wavelength 1.06 μm (Infrared) ...
10649. High Precision 15W UV Laser Dicing Tool for Efficient Wafer Cutting [Aug 27, 2026]
[Aug 27, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
10650. High-Precision UV Laser Engraver for Industrial Die Marking [Aug 27, 2026]
[Aug 27, 2026] Product Description Fully Automatic Wafer DIE Laser Marking System: The Future of Semiconductor Marking Introduction The Fully Automatic Wafer DIE Laser Marking System is a cutting-edge semiconductor marking technology ...
