Jiangsu Profile
Product List
2281. Soldering Iron & Soldering Station (FC-16161) 
[Sep 09, 2015]
[Sep 09, 2015] Changzhou FOCAN electronic factory can be produce and provide All kind of Soldering Iron ; Soldering Iron GUN ; Desoldering Pump High Precision Temperature-Controlled, Soldering Iron station , welding ...
Company: FOCAN ELECTRONIC FACTORY
2282. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2283. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2284. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2285. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2286. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2287. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2288. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2289. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2290. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2291. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2292. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2293. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2294. CNC Machining High Precision Metal/Steel/ Aluminium /Copper Alloy/Brass Gold Plated Connector ... [Aug 01, 2024]
[Aug 01, 2024] Material 1). Aluminum: AL 6061-T6, 6063, 7075-T etc 2). Stainless steel: 303,304,316L, 17-4(SUS630) etc 3). Steel: 45#,Q235, Q345B 4). Titanium: TA1,TA2/GR2,TA4/GR5 5). Brass;Sheet metal 6). Copper, bronze, ...
2295. High Temp Pi Tape Polyimide High Temperature Resistant Tape Silicone Adhesive - for 3D Print Bed ... [Nov 02, 2022]
[Nov 02, 2022] High Temp PI Tape Polyimide High Temperature Resistant Tape Silicone Adhesive - for 3D Print Bed Soldering Masking etc Products with many physical requirements can also be customized for die cutting processing, and ...
