Jiangsu Profile
Product List
21166. Metal Base Copper Substrate Board Copper Circuit Board PCB 
[Jun 23, 2024]
[Jun 23, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21167. Aln Insulation Sheet Laser Scribing Aluminum Nitride Substrate Ceramic Printed Circuit Board [Jun 23, 2024]
[Jun 23, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21168. Car Light Heat Dissipation Circuit Board Aluminum Substrate PCB [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21169. Single-Sided Aluminum Substrate Heat Dissipation Circuit Board PCB [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21170. High Thermal Conductivity Aluminum Substrate PCB in Kunshan [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21171. Round Lamp Aluminum Substrate Heat Dissipation Circuit Board PCB [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21172. Thick Plate Aluminum Substrate PCB Factory in Kunshan [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21173. CREE Lamp Aluminum Substrate Printed Circuit Board [Jun 22, 2024]
[Jun 22, 2024] Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness ...
21174. Good Insulation 96% Alumina Laser Drilling Substrate Electronic Ceramic Sheet [Jan 09, 2023]
[Jan 09, 2023] Product Description The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film ...
21175. Frosted Opaque Quartz Glass Window Disc Substrate Plate with Holes [Apr 06, 2022]
[Apr 06, 2022] Product Description Shengfan Machining Quartz Products Characteristic * Name Machining quartz products * Brand Shengfanquartz * SIO2 ≥99.99% * Degree of hardness moh' scale 6.6 * Melting point ...
21176. Needle Punching Insole Sheet Nonwoven Substrate Making Machine [Jun 22, 2021]
[Jun 22, 2021] Nonwoven needle loom -Nonwoven needle punching machine Functionality & application: 1.By means of the needle punching process, the ...
21177. 1.8mm Single Hook Substrate Terminal Customizable Electric Wire Connecting Terminal [Dec 27, 2024]
[Dec 27, 2024] Company Profile Suzhou Ugiant New Materials Co., LTD mainly specializes in manufacturing and export of cables and connectors. We are also ...
21178. Substrate Material Fr4 Copper Clad Laminated Sheet for PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
21179. Electronic Substrate Material Copper Clad Laminated Fr4/Fr1 Ccl Sheet [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
21180. Aluminum Substrate Copper Clad Laminate for LED PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
