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Aluminium Nitride Ceramic Substrate – High Thermal Conductivity & Electrical Insulation

21946.

Aluminium Nitride Ceramic Substrate – High Thermal Conductivity & Electrical Insulation Open Details in New Window [Aug 28, 2025]

Aluminium Nitride Substrate [MH-ZT-Aluminium Nitride] Product Features Introducing our high-performance Aluminum Nitride (AlN) Substrate, designed to meet the demands of advanced electronic and thermal management ...

Company: Suzhou Moat City Technology Ltd

UV Customized Heat Resistant Fused Silica Quartz Glass Plate Clear Quartz Glass Substrate Quartz ...

21947.

UV Customized Heat Resistant Fused Silica Quartz Glass Plate Clear Quartz Glass Substrate Quartz ... Open Details in New Window [Jan 08, 2025]

Product Description UV Customized Heat Resistant Fused Silica Quartz Glass Plate Clear Quartz Glass Substrate quartz plate drilled labor Advantage of Quartz Glass Plate: 1.High purity :SiO2> 99.99%. 2.Operating ...

Company: JIANGSU HONGYANG QUARTZ PRODUCTS CO.,LTD.

Smart School Boards Teaching Electronic Interactive Whiteboard Substrate Laser TV

21948.

Smart School Boards Teaching Electronic Interactive Whiteboard Substrate Laser TV Open Details in New Window [Feb 04, 2024]

Products Description Aluminum honeycomb panel is structured of the interlining of honeycomb type. It is a kind of high strength external building material, which was only applied in the aeronautic industry in the past. ...

Company: Zhangjiagang Jianglian Precision Machinery Co., Ltd.

High Purity Aluminum Oxide Al2O3 Alumina Ceramic Substrates/Plate/Sheet

21949.

High Purity Aluminum Oxide Al2O3 Alumina Ceramic Substrates/Plate/Sheet Open Details in New Window [Apr 27, 2023]

Lianyungang Jialei electronic technology co., ltd. is a comprehensive company integrated in the production and export of infrared heaters, heating elements and quartz products. our companies focus our innovations on ...

Company: Lianyungang Jialei Electronic Technology Co., Ltd.

180W Aluminum Nitride Disk Aln Ceramic Substrate Disc for Communication Components

21950.

180W Aluminum Nitride Disk Aln Ceramic Substrate Disc for Communication Components Open Details in New Window [Jan 09, 2023]

Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...

Company: Lianyungang Quayer Electronic Technology Co., Ltd.

Suzhou Beecore Air Filter Metal Honeycomb Substrate Aluminum Honeycomb Filter

21951.

Suzhou Beecore Air Filter Metal Honeycomb Substrate Aluminum Honeycomb Filter Open Details in New Window [Dec 19, 2017]

SUZHOU BEECORE air filter metal honeycomb substrate aluminum honeycomb filter: Description: The Activated Carbon Filter is our newly developed to efficiently filter to remove obsorb harmful odor and micro duty ...

Company: Suzhou Beecore Honeycomb Materials Co., Ltd.

Corrosion-Resistant Metallic Catalyst with Porous Substrate for Marine Applications

21952.

Corrosion-Resistant Metallic Catalyst with Porous Substrate for Marine Applications Open Details in New Window [May 19, 2025]

Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...

Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.

Good Flow-Ability Metallic Substrate Car Catalyst for Automotive Exhaust Treatment

21953.

Good Flow-Ability Metallic Substrate Car Catalyst for Automotive Exhaust Treatment Open Details in New Window [May 16, 2025]

Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...

Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.

Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods

21954.

Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods Open Details in New Window [Dec 25, 2023]

Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Die Bonding, Process for Placing a Chip on a Package Substrate

21955.

Die Bonding, Process for Placing a Chip on a Package Substrate Open Details in New Window [Nov 09, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Die Bonding Machine, with The Process for Molding a Chip on Substrate

21956.

Die Bonding Machine, with The Process for Molding a Chip on Substrate Open Details in New Window [Oct 18, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

A Grade Single Side Electrical Substrate Material 1.6mm Fr4/Xpc Ccl for PCB

21958.

A Grade Single Side Electrical Substrate Material 1.6mm Fr4/Xpc Ccl for PCB Open Details in New Window [Aug 21, 2024]

Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...

Company: Wuxi Chifeng Metal Products Co., Ltd.

Ce and UL Certificated WPC PVC Foam Board Flooring Substrate Conical Double Screw Extrusion ...

21959.

Ce and UL Certificated WPC PVC Foam Board Flooring Substrate Conical Double Screw Extrusion ... Open Details in New Window [Aug 14, 2023]

CE and UL Certificated WPC PVC Foam Board Flooring Substrate Conical Double Screw Extrusion Production Line I.Main Designing Parameter of production line 1.1 Power condition:380V/ 3phase/50HZ (or ...

Company: Wuxi Boyu Plastic Machinery Co., Ltd.

Corundum-Mullite Saggar for Silicon Carbide Substrate, 2100 °C, Ar Flow

21960.

Corundum-Mullite Saggar for Silicon Carbide Substrate, 2100 °C, Ar Flow Open Details in New Window [Dec 11, 2025]

Corundum-Mullite Saggar - Extreme-Temperature Kiln Furniture for Next-Generation Battery & Ceramic Processing Product Overview Manufactured from 75 % high-purity tabular alumina and 25 % needle-like mullite ...

Company: Suzhou Moat City Technology Ltd