Jiangsu Profile
Product List
28441. Customized Silicon Nitride Plate Si3n4 Substrate Ceramic Board 
[Jan 09, 2023]
[Jan 09, 2023] Product Description Silicon nitride ceramic is an inorganic material ceramic that does not shrink when sintered. Silicon nitride is very strong, especially hot pressed silicon nitride, which is one of the hardest ...
28442. 1.6mm 35/0um Aluminum Substrate Copper Clad Laminate for LED PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
28443. 170W Aluminium Nitride Ceramic Substrate Electronic Ceramic Sheet Aln Plate for LED [Jan 09, 2023]
[Jan 09, 2023] Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...
28444. Aluminum Based Copper Clad Laminate Sheet Aluminum Substrate Aluminum Ccl Al [Aug 21, 2024]
[Aug 21, 2024] Products Description Al-CCL standard size is 1000*1200mm(40*48 inch),thickness from 0.4mm to 4mm.Thermal conductivity include 0.5,1,1.5,2.0W.And all our products have been compiled series with all complete ...
28445. Honeycomb Panels for Solar Cell Assembly Substrate [Sep 27, 2023]
[Sep 27, 2023] General Information Aluminum honeycomb panel is sandwich panel bonded with aluminium face material and with a core in aluminium honeycomb. It offers high mechanical properties and good fire performances. The aluminum ...
Company: Kunshan Bihore Honeycomb Materials Technology Co., Ltd.
28446. Best Quality Paper Fabric Film Multi-Substrate Laminating Machine [Nov 02, 2021]
[Nov 02, 2021] Product Description General Overview of China automatic paper coating machine paper laminating machine 1000-2200mm thickness of coating film 0.012~0.1mm inaccuracy thickness of coating ...
28447. Electronic Substrate Material Copper Clad Fiberglass Laminated Fr4 Ccl Sheet [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
28448. 180W Aluminum Nitride Disk Aln Ceramic Substrate Disc for Communication Components [Jan 09, 2023]
[Jan 09, 2023] Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...
28449. Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods [Dec 25, 2023]
[Dec 25, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
28450. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
28451. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
28452. A Grade Single Side Electrical Substrate Material 1.6mm Fr4/Xpc Ccl for PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
28453. High Speed Die Bonding Machine- Process for Molding a Chip on a Package Substrate [Oct 16, 2023]
[Oct 16, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
28454. 18 Tube Aluminum Substrate Sine Wave Brushless Motor Controller [Feb 22, 2023]
[Feb 22, 2023] 1. Q: Can I get samples? How long do you make sample? A: Yes, samples are available for you to check quality. 1-3days, free time and busy time to different. 2. Q: Do you have products in stock? A: Mostly No. All ...
28455. 95%~99% Al2O3 Alumina Ceramic Substrates & Alumina Plates [Oct 16, 2014]
[Oct 16, 2014] 1. Material: High quality alumina ceramic — — A environmental &insulated &secure material, fired in more than 1600 degree temperature. Does not contain any toxic and harmful substances. 2. Advantages: ...
Company: Yixing Shenxing Technology Co., Ltd.
