Jiangsu Profile
Product List
29686. Sodium Chloride Wafer Substrate Nacl Substrate Nacl Wafers 
[Aug 21, 2024]
[Aug 21, 2024] Jiangyin Entret Coating Technology Co., Ltd can suppuly main products and services as: (1)To engage in the growth and development of various optical & laser crystal (2) offers orienting, cutting and grinding, ...
29687. Aluminium Sputtering Target for Coating [Sep 03, 2018]
[Sep 03, 2018] Aluminum Sputtering Target Of High Quality, 99.99% Purity, Al Target Item: Aluminum Sputtering Target Purity: 4N Specification: Customized About Us Because of the high quality you will be satisfied with ...
29688. Aluminum Target for Vacuum Sputtering Coating [Sep 03, 2018]
[Sep 03, 2018] Aluminum Target for Vacuum Sputtering Coating Item: Aluminum Sputtering Target Purity: ≥ 4N Specification: Customized About Us Because of the high quality you will be satisfied with our product. We are ...
29689. Aluminium Sputtering Target of High Quality, Al Target of High Purity [Sep 03, 2018]
[Sep 03, 2018] Aluminium Sputtering Target of High Quality, Al Target Of High Purity Item: Aluminum Sputtering Target Purity: 4N Specification: Customized About Us Because of the high quality you will be satisfied with ...
29690. Aluminium Sputtering Target [Sep 03, 2018]
[Sep 03, 2018] Aluminum Sputtering Target Of High Quality, 99.99% Purity, Al Target Item: Aluminum Sputtering Target Purity: 4N Specification: Customized About Us Because of the high quality you will be satisfied with ...
29691. Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods [Dec 25, 2023]
[Dec 25, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
29692. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
29693. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
29694. High Speed Die Bonding Machine- Process for Molding a Chip on a Package Substrate [Oct 16, 2023]
[Oct 16, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
29695. Mushroom Cultivation Spawn Supply Myco Bag Bulk Substrate Bags, Large 6"X5"X20" Extra Thick 80 ... [Mar 22, 2023]
[Mar 22, 2023] Mushroom Cultivation Spawn Supply Myco Bag Bulk Substrate Bags, Large 6"x5"x20" Extra Thick 80 Micron (=3 Mil) AUTOCLAVABLE MUSHROOM GROWING BAGS - Made from polyethylene (PE) plastic, these bags are designed to ...
29696. Hot Air Cotton Non Woven Fabric for Namofiltration Substrate [Aug 22, 2024]
[Aug 22, 2024] · Our Products------------------------------ Our products are well known for their uniform web-forming, high tensile strength, clear opacity, breathability and softness to the touch,has passed ...
29697. Good Insulation 114X114X0.5mm Aluminium Nitride Ceramic Plate Substrate Aln Sheet [Jan 09, 2023]
[Jan 09, 2023] Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...
29698. Electronic Insulation 96% Alumina Ceramic Substrate Ceramic Sheet Al2O3 Plate [Jan 09, 2023]
[Jan 09, 2023] Product Description The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film ...
29699. Filament Yarn for Substrate [Aug 23, 2024]
[Aug 23, 2024] Introduction to PTFE filament NETTtex® ptfe filament, produced by "paste extrusion" process, has round diameter, uniform drying, large modulus (stiffness), no fuzz ...
29700. Reliable Multilayer Circuit Board Manufacture Service with Fr-4 Substrate [Jul 09, 2024]
[Jul 09, 2024] Detailed Photos Our Service 1. PCB design ,PCB clone and copy ,ODM service. 2. Schematic design and Layout 3. Fast PCB&PCBA prototype and Mass Production 4. Electronic Components Sourcing Services 5. ...
