Jiangsu Profile
Product List
45061. Waterproof 5mm/6mm/4mm Wood Grain PVC Lvt Click Vinyl Floor Spc Flooring 
[Oct 09, 2025]
[Oct 09, 2025] Product Description What is SPC? SPC, it is the abbreviations for stone plastic composite flooring, also known as Rigid Vinyl Plank. PVC wear-resistant layer, PVC color-film and PVC substrates these three structures ...
45062. Corning Fused Silica Cylindrical Lens for Lighting from UV to VIS wavelength [Aug 10, 2025]
[Aug 10, 2025] Fully Polished BK7 Glass Optical Plano Concave Lens Specifications: Items Description Plano Concave Lens Material: N-BK7 or fused silica Diameter: S2:120.50+0.05/-0.00mm S1:90.0+/-0.10mm Center ...
Company: CPG OPTICS LIMITED
45063. Precision customize-made coated/uncoated corner cube of factory price [Aug 10, 2025]
[Aug 10, 2025] Precision customize-made coated/uncoated corner cube of factory price Specification: Substrate Material: BK7, Fused Silica, Sapphire, IR material, etc Dimension tolerance(mm): +/-0.05,+/-0.1,etc Beam ...
Company: CPG OPTICS LIMITED
45064. Excellence in Fire-Retardant Fiberglass Black for Glass Wool Sound Insulation Panel [Aug 22, 2024]
[Aug 22, 2024] Introduction: This black non-woven glass tissue is fire-resistant and alkali-free fiberglass tissue ,with dyeing process to made it black color. This black non-woven glass tissue is mainly used As surface layer of ...
Company: CHANGZHOU JLON COMPOSITE CO., LTD.
45065. High-Precision Automated Laser Marking System for Industrial Use [Dec 24, 2025]
[Dec 24, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
45066. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Dec 31, 2025]
[Dec 31, 2025] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
45067. Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers [Dec 24, 2025]
[Dec 24, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
45068. Qualicoat Class Polyester Powder Coating Sand Effect for Aluminum Profile [Dec 24, 2025]
[Dec 24, 2025] Qualicoat Class Polyester Powder Coating Sand Effect for Aluminum Profile What is Powder Coating? Powder coating is a new type of 100% solid powder coating which does not contain solvents. With no solvent, no ...
Company: Nanjing Ever Coatings Co., Ltd.
45069. Precision Wafer Alignment Technology for Superior Circuit Manufacturing [Dec 19, 2025]
[Dec 19, 2025] Product Description For calibration steps in various devices within the semiconductor manufacturing process, capable of handling semiconductor wafers or glass substrates ranging from 6 inches to 12 inches. the products ...
45070. Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment [Dec 17, 2025]
[Dec 17, 2025] Product Description Technical Overview: High-Speed Die Bonding (Die Attach) Systems Die Bonding is the foundational step in semiconductor assembly.It involves picking a single silicon die (chip) from a processed ...
45071. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Dec 13, 2025]
[Dec 13, 2025] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
45072. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
45073. Fully Automatic Butyl Adhesive Coating Machine [Dec 13, 2025]
[Dec 13, 2025] Features •The glue process only melts the top part of the barrel glue and the remaining material remains solid, reducing the influence of thermal stress on the original characteristics ot the glue; •The ...
45074. Advanced Eutectic Die Bonder for Semiconductor Manufacturing Excellence [Dec 13, 2025]
[Dec 13, 2025] Product Description Category Sub - Category Parameter Chip Application COC Chip size 0.15mm< Chip size ≤1.5mm Substrate size 0.15mm≤ Substrate size ≤4mm Velocity Production cycle (1 chip) 70s Accuracy Patch pressure ...
45075. High Precision Single Mode Alignment System [Dec 13, 2025]
[Dec 13, 2025] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
