Jiangsu Profile
Product List
45526. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System 
[Dec 31, 2025]
[Dec 31, 2025] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
45527. Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers [Dec 24, 2025]
[Dec 24, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
45528. Qualicoat Class Polyester Powder Coating Sand Effect for Aluminum Profile [Dec 24, 2025]
[Dec 24, 2025] Qualicoat Class Polyester Powder Coating Sand Effect for Aluminum Profile What is Powder Coating? Powder coating is a new type of 100% solid powder coating which does not contain solvents. With no solvent, no ...
Company: Nanjing Ever Coatings Co., Ltd.
45529. Precision Wafer Alignment Technology for Superior Circuit Manufacturing [Dec 19, 2025]
[Dec 19, 2025] Product Description For calibration steps in various devices within the semiconductor manufacturing process, capable of handling semiconductor wafers or glass substrates ranging from 6 inches to 12 inches. the products ...
45530. Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment [Dec 17, 2025]
[Dec 17, 2025] Product Description Technical Overview: High-Speed Die Bonding (Die Attach) Systems Die Bonding is the foundational step in semiconductor assembly.It involves picking a single silicon die (chip) from a processed ...
45531. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Dec 13, 2025]
[Dec 13, 2025] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
45532. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
45533. Fully Automatic Butyl Adhesive Coating Machine [Dec 13, 2025]
[Dec 13, 2025] Features •The glue process only melts the top part of the barrel glue and the remaining material remains solid, reducing the influence of thermal stress on the original characteristics ot the glue; •The ...
45534. Advanced Eutectic Die Bonder for Semiconductor Manufacturing Excellence [Dec 13, 2025]
[Dec 13, 2025] Product Description Category Sub - Category Parameter Chip Application COC Chip size 0.15mm< Chip size ≤1.5mm Substrate size 0.15mm≤ Substrate size ≤4mm Velocity Production cycle (1 chip) 70s Accuracy Patch pressure ...
45535. High Precision Single Mode Alignment System [Dec 13, 2025]
[Dec 13, 2025] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
45536. High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System [Dec 13, 2025]
[Dec 13, 2025] Deep Reactive Ion etching of Silicon ICP Etcher The ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible ...
45537. High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series) [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision ...
45538. High-Precision CO2 Laser Marking Machine for Deep Engraving [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
45539. Smema Compliant Hdz-PCB100: Fully Automatic Inline PCB Laser Marking Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description Maximize PCB Traceability & Efficiency with the LASER PCB100 Laser Marking Machine In the precise world of printed circuit board (PCB) manufacturing, every detail matters-especially permanent, ...
45540. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Dec 13, 2025]
[Dec 13, 2025] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
