Jiangsu Profile
Product List
64861. Surface Treatment: Stone Texture Embossed Melamine MDF 
[Sep 13, 2026]
[Sep 13, 2026] Product description: Specifications of plain MDF /melamine mdf board size 1220*2440mm 1220*2745mm 1220*2800mm 1220*3050mm. 1830*2440mm 1830*2750mm 2100*2800 thickness 2~25mm Core ...
64862. Customized Passenger Car Production Line Automotive Fixture Welding Line [Sep 08, 2026]
[Sep 08, 2026] Product Description What are Jigs? A jig is a large brace that keeps a welding project stable in the face of pressure, heat, motion, and force. A quality jig will streamline welding work by keeping parts together ...
Company: China Vehicle Industry Co., Ltd
64863. Fine Flatness Optical Glass Rejection Filters for Color Sensors [Sep 09, 2026]
[Sep 09, 2026] Product Description Characteristics High wavelength selectivity: Capable of precise response to extremely narrow (<1mm) or specific wavelength ranges. High transmission and deep blocking: Transmission within the ...
64864. High Transmittance Low Dispersion Custom Achromatic Optical Lens for Machine Vision [Sep 09, 2026]
[Sep 09, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
64865. Advanced Laser Lift-off System for Efficient GaN Layer Separation [Sep 07, 2026]
[Sep 07, 2026] Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...
64866. Versatile 550°C Ceramic Hot Air Drying Oven for Professionals [Sep 30, 2026]
[Sep 30, 2026] Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...
64867. Smart Automated Microchip Dispensing Solutions for Manufacturing Efficiency [Sep 28, 2026]
[Sep 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
64868. High-Precision Automatic Die Bonder for LED Packaging Efficiency [Sep 28, 2026]
[Sep 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
64869. Advanced Laser Marking Machine for Electronics and Components [Sep 28, 2026]
[Sep 28, 2026] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...
64870. Advanced Laser Trimming Solutions for Efficient PCB Production [Sep 28, 2026]
[Sep 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
64871. Custom Precision Optical Focusing Lens for Imaging and Laser Systems [Sep 30, 2026]
[Sep 30, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
64872. Advanced High Precision Die Bonder for Semiconductor Assembly Solutions [Sep 28, 2026]
[Sep 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
64873. Advanced Laser Cutting Technology for LED Wafer Manufacturing [Sep 29, 2026]
[Sep 29, 2026] Product Description This series of equipment is designed specifically for the characteristics of silicon substrate wafer laser cutting, using ultraviolet lasers A set of external optical path system, combined with ...
64874. Advanced High-Speed Die Attach Machines for Precision Chip Assembly [Sep 02, 2026]
[Sep 02, 2026] High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ...
64875. Precision Laser Debonding System for Efficient Material Separation [Sep 23, 2026]
[Sep 23, 2026] Product Description Fully Automatic Laser Debonding Equipment - Introduction Overview Fully automatic laser debonding equipment is a precision semiconductor packaging tool designed to separate device wafers from ...
