Jiangsu Profile
Product List
15601. 2023 Customized School Science Laboratory Bench Lab Table Medical Lab Equipment 
[Jul 05, 2023]
[Jul 05, 2023] Product Name Chemistry Laboratory Equipment Colour Customized Dimension Running Lenth * 750 *800mm (custom-made) Structure C-Frame & H-Frame & Floor Mounted Worktop a. 19mm thickness epoxy resin. b. 20mm ...
Company: Jiangsu Cartmay Industrial Co., Ltd.
15602. Hot Sale Stainless Lab Side Table Newest PP Lab Equipment [Dec 19, 2022]
[Dec 19, 2022] Chemical Work Table Lab Bench, Chemistry Laboratory Equipment Overview Quick Details General Use: Commercial Furniture Type: Laboratory Furniture Mail packing:Y ...
Company: Jiangsu Cartmay Industrial Co., Ltd.
15603. Far 25.853 Part IV Osu Heat Release Rate Testing Equipment by ASTM E906 [Jul 22, 2021]
[Jul 22, 2021] Introduction: The OSU heat release rate testing equipment, originally designed by Smith of Ohio State University in 1972, became FAA's designated combustion tester. The test standards are FAR Part 25 Appendix F Part ...
Company: Advanced Instruments Co., Limited
15604. X-ray Non-Destructive Testing Equipment [Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
15605. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
15606. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
15607. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
15608. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
15609. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
