Jiangsu Profile
Product List
18241. Far 25.853 Part IV Osu Heat Release Rate Testing Equipment by ASTM E906 
[Jul 22, 2021]
[Jul 22, 2021] Introduction: The OSU heat release rate testing equipment, originally designed by Smith of Ohio State University in 1972, became FAA's designated combustion tester. The test standards are FAR Part 25 Appendix F Part ...
Company: Advanced Instruments Co., Limited
18242. Modern Metal Laboratory Table Factory Marble Top Laboratory Equipment [Jul 05, 2023]
[Jul 05, 2023] Chemical Work Table Lab Bench, Chemistry Laboratory Equipment Overview Quick Details General Use: Commercial Furniture Type: Laboratory Furniture Mail packing:Y ...
Company: Jiangsu Cartmay Industrial Co., Ltd.
18243. X-ray Non-Destructive Testing Equipment [Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
18244. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
18245. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
18246. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
18247. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
18248. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
