Jiangsu Profile
Product List
16756. High-Performance Compact BGA Rework Station for Precision Repairs 
[Mar 24, 2026]
[Mar 24, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16757. Versatile Advanced BGA Rework Station for Customizable PCB Solutions [Mar 24, 2026]
[Mar 24, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16758. Advanced High-Precision BGA Rework Station for Professional Use [Mar 24, 2026]
[Mar 24, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16759. Efficient Professional BGA Repair Station for Advanced SMT Applications [Mar 24, 2026]
[Mar 24, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16760. Magnesium Oxide Insulation MGO Ceramic Tube for Cartridge Heater [Mar 23, 2026]
[Mar 23, 2026] Product Description Magnesium oxide is a kind of alkaline oxide, the reaction with water, magnesium hydroxide to produce insoluble in water, reaction with acid magnesium salt, magnesium oxide used as refractory ...
16761. High Thermal Stability Si3n4 Stalk Pipe Silicon Nitride Ceramic Riser Tube [Mar 23, 2026]
[Mar 23, 2026] Silicon nitride tube has good thermal conductivity, high temperature strength, wear resistance, strong corrosion resistance and good thermal stability. Such outstanding performance. It is widely used in the ...
16762. Advanced BGA Rework Station for Versatile and Compact Applications [Mar 21, 2026]
[Mar 21, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16763. Efficient BGA Rework Station for Customizable Chip Repair Needs [Mar 21, 2026]
[Mar 21, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16764. Compact BGA Rework Station for High-Precision and Customizable Repairs [Mar 21, 2026]
[Mar 21, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16765. Versatile BGA Rework Station for Professionals Handling Various PCB Sizes [Mar 21, 2026]
[Mar 21, 2026] PCB size Max 570×450mm, Min 10×10mm PCB thickness 0.3-8mm Suitable chips Max 100×100mm, Min 1×1mm(customizable) Workbench fine-tuning Before and after ±15mm, left and right ±15mm Temperature control The closed-loop ...
16766. Radiant Panel Flame Spread Test Machine with ISO 5658 [Mar 18, 2026]
[Mar 18, 2026] Description: TESTECH flame spread tester is design according to ISO5658-2 standard D and production, while meeting the IMO FTP Code Resolution A. 653 (16) and ASTM E 1317 requirements. Lateral flame propagation ...
16767. ISO5658 Radiant Panel Flame Spread Test Machine [Mar 18, 2026]
[Mar 18, 2026] Description: TESTECH flame spread tester is design according to ISO5658-2 standard D and production, while meeting the IMO FTP Code Resolution A. 653 (16) and ASTM E 1317 requirements. Lateral flame propagation ...
16768. Long Tube Pressure Vessel Process Distillation Absorption Tower [Mar 06, 2026]
[Mar 06, 2026] 2Product Overview: Advanced Tubular Heat Exchanger for Demanding Industrial Applications Our high-performance Tubular Heat Exchanger represents the pinnacle of thermal transfer technology, engineered for reliability, ...
16769. High-Performance Vacuum Eutectic Welding Furnace with Plasma Technology [Mar 03, 2026]
[Mar 03, 2026] Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by microwave plasma is mainly used for high reliability cavity free brazing of high-power chips and substrate ...
16770. Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
