Jiangsu Profile
Product List
8011. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... 
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8012. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8013. FUJI Cr High-Definition Industrial Digital Non-Destructive Testing NDT Xray System [Mar 27, 2025]
[Mar 27, 2025] Wuxi Ruishite Technology Co., LTD. (formerly known as Wuxi Yimu Film Co., LTD.) was founded in 2001 in Wuxi City, Jiangsu Province, which is located in the Yangtze River Delta economic circle and enjoys convenient ...
Company: Wuxi Ruishite Technology Co., Ltd
8014. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8015. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8016. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8017. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8018. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8019. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8020. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8021. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8022. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8023. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8024. Portable Backscatter Imaging System BCS-140, Real Time Imaging Handheld Backscatter, X Ray Imaging ... [Mar 21, 2025]
[Mar 21, 2025] Features: 1) Use advanced backscatter imaging: backscattering is the use of low-energy X-rays to illuminate a point on an object, and the detector collects information about this point from the scattered rays. X-ray ...
8025. High Measure Effeciency of Thermol Neutron He-3 Neutron Detector [Jul 28, 2023]
[Jul 28, 2023] Product Description Detailed Photos Product Parameters Certifications Company Profile FAQ 1. Q: What are the main products that Amber Bridge supply? A: We maindly supply speciality gases, stable isotopes, ...
Company: Amber Bridge High Tech Material Technology (Jiangsu) Co., Ltd.
