Jiangsu Profile
Product List
5596. Phoenix Contact Wire Terminal 3004032 UK 5-Mtk-P/P - Knife-Disconnect Terminal Block 
[Dec 18, 2025]
[Dec 18, 2025] Phoenix Contact Wire Terminal 3004032 UK 5-MTK-P/P - Knife-disconnect terminal block Knife-disconnect terminal block, With test socket screws for insertion of test plugs, nom. voltage: 500 V, nominal current: 16 A, ...
Company: Nanjing Inter Energy Co., Ltd.
5597. Phoenix Contact Original 3003923 Uslkg 10 N - Protective Conductor Terminal Block [Dec 18, 2025]
[Dec 18, 2025] Phoenix Contact Original 3003923 USLKG 10 N - Protective conductor terminal block Protective conductor terminal block, number of connections: 2, connection method: Screw connection, Rated cross section: 10 mm2, cross ...
Company: Nanjing Inter Energy Co., Ltd.
5598. High Temperature Refractory 99% Corundum Alumina Al2O3 Ceramic Tray Sagger Used in Kiln Furnace [Dec 18, 2025]
[Dec 18, 2025] Product Description: The corundum ceramic saggers are used more often in ...
5599. Phoenix Contact Wire Terminal 3003020 D-UK 4/10 - End Cover for DIN Rail [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Wire Terminal 3003020 D-UK 4/10 - End cover for Din Rail End cover, depth: 35.9 mm, width: 1.8 mm, height: 42.5 mm, color: gray Ambient temperature (operation) -60 °C ... 110 °C (Operating temperature ...
Company: Nanjing Inter Energy Co., Ltd.
5600. Phoenix Contact Original 3002225 Junction Block UK 3-Twin - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Original 3002225 Junction Block UK 3-TWIN - Feed-through terminal block Feed-through terminal block, nom. voltage: 400 V, nominal current: 24 A, connection method: Screw connection, 1 level, Rated cross ...
Company: Nanjing Inter Energy Co., Ltd.
5601. Phoenix Contact Original Wire Terminal 3001938 UK 6-Fsi/C-LED24 - Fuse Modular Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Original Wire Terminal 3001938 UK 6-FSI/C-LED24 - Fuse modular terminal block Fuse modular terminal block, fuse type: Blade, fuse type: C, nom. voltage: 24 V, nominal current: 30 A, number of positions: ...
Company: Nanjing Inter Energy Co., Ltd.
5602. Phoenix Contact Spring Terminal 3001501 UK 3 N - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Spring terminal 3001501 UK 3 N - Feed-through terminal block Feed-through terminal block, nom. voltage: 800 V, nominal current: 24 A, number of connections: 2, connection method: Screw connection, Rated ...
Company: Nanjing Inter Energy Co., Ltd.
5603. Phoenix Contact Wire Terminal 3001035 UK 2, 5 B - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Wire Terminal 3001035 UK 2,5 B - Feed-through terminal block Feed-through terminal block, nom. voltage: 690 V, nominal current: 24 A, number of connections: 2, connection method: Screw connection, cross ...
Company: Nanjing Inter Energy Co., Ltd.
5604. Phoenix Contact Wire Terminal Original 3000610 Uttb 4 Hv - Double-Level Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact wire terminal Original 3000610 UTTB 4 HV - Double-level terminal block Double-level terminal block, nom. voltage: 1000 V, nominal current: 30 A, connection method: Screw connection, Rated cross section: ...
Company: Nanjing Inter Energy Co., Ltd.
5605. Advanced Laser Wafer Marking Machine for Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
5606. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
5607. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
5608. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
5609. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
5610. High Quality Vacuum Dry Oven Lab Drying Equipment for Battery Materials Drying [Dec 10, 2025]
[Dec 10, 2025] Product Description Please enter the title here Vacuum drying chamber, also known as (vacuum drying chamber), is specially designed for biological samples, pharmaceutical preparations, electronic products, silica gel ...
Company: Wuxi Marit Technology Co., Ltd
