Jiangsu Profile
Product List
5626. Phoenix Contact Wire Terminal 3003020 D-UK 4/10 - End Cover for DIN Rail 
[Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Wire Terminal 3003020 D-UK 4/10 - End cover for Din Rail End cover, depth: 35.9 mm, width: 1.8 mm, height: 42.5 mm, color: gray Ambient temperature (operation) -60 °C ... 110 °C (Operating temperature ...
Company: Nanjing Inter Energy Co., Ltd.
5627. Phoenix Contact Original 3002225 Junction Block UK 3-Twin - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Original 3002225 Junction Block UK 3-TWIN - Feed-through terminal block Feed-through terminal block, nom. voltage: 400 V, nominal current: 24 A, connection method: Screw connection, 1 level, Rated cross ...
Company: Nanjing Inter Energy Co., Ltd.
5628. Phoenix Contact Original Wire Terminal 3001938 UK 6-Fsi/C-LED24 - Fuse Modular Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Original Wire Terminal 3001938 UK 6-FSI/C-LED24 - Fuse modular terminal block Fuse modular terminal block, fuse type: Blade, fuse type: C, nom. voltage: 24 V, nominal current: 30 A, number of positions: ...
Company: Nanjing Inter Energy Co., Ltd.
5629. Phoenix Contact Spring Terminal 3001501 UK 3 N - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Spring terminal 3001501 UK 3 N - Feed-through terminal block Feed-through terminal block, nom. voltage: 800 V, nominal current: 24 A, number of connections: 2, connection method: Screw connection, Rated ...
Company: Nanjing Inter Energy Co., Ltd.
5630. Phoenix Contact Wire Terminal 3001035 UK 2, 5 B - Feed-Through Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact Wire Terminal 3001035 UK 2,5 B - Feed-through terminal block Feed-through terminal block, nom. voltage: 690 V, nominal current: 24 A, number of connections: 2, connection method: Screw connection, cross ...
Company: Nanjing Inter Energy Co., Ltd.
5631. Phoenix Contact Wire Terminal Original 3000610 Uttb 4 Hv - Double-Level Terminal Block [Dec 17, 2025]
[Dec 17, 2025] Phoenix Contact wire terminal Original 3000610 UTTB 4 HV - Double-level terminal block Double-level terminal block, nom. voltage: 1000 V, nominal current: 30 A, connection method: Screw connection, Rated cross section: ...
Company: Nanjing Inter Energy Co., Ltd.
5632. High Quality Black Adjustable PU Foam Anti-Static ESD Computer Lab Chairs (JH-ST004) [Dec 17, 2025]
[Dec 17, 2025] 10+ years of manufacturing and exporting experience Type: JH-ST004 Specification: Seat PU leather surface with top base size: 430*400mm and back size 400X300mm. Bottom base and connection band Steel ...
5633. Anti-Static PU (polyurethane) Foam Lab Chair/Lab Stool (JH-ST013) [Dec 17, 2025]
[Dec 17, 2025] 10+ years of manufacturing and exporting experience Type: JH-ST013 Specification : Seat PU foam stool base surface with size 420X400mm, the back size is 380X260mm Bottom base Steel treated by ...
5634. Transformation Art Coffee Dripper Filter Porcelain Portable Pour Over Coffee Maker Set [Dec 16, 2025]
[Dec 16, 2025] Product name Kiln Transformation Art Coffee Dripper Filter Size two size is optional 9*12cm/7.5*9.5cm Usage Making coffee/Home/Office/Bar/Cafe/ Function filter,dripper Packing Color ...
Company: LIANYUNGANG KAESHING INTERNATIONAL TRADING CO., LTD.
5635. Advanced Laser Wafer Marking Machine for Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
5636. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
5637. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
5638. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
5639. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
5640. Quality Precision Test Chamber High Temperature Industrial Vacuum Drying Oven [Dec 12, 2025]
[Dec 12, 2025] Product Description Please enter the title here Vacuum drying chamber, also known as (vacuum drying chamber), is specially designed for biological samples, pharmaceutical preparations, electronic products, silica gel ...
Company: Wuxi Marit Technology Co., Ltd
