Jiangsu Profile
Product List
23326. Heko DC140mm Wood Chip Suction Hydroponics High Temperature Centrifugal Dust Extraction Fan 
[Oct 10, 2024]
[Oct 10, 2024] Place of origin: Jiangsu, China Fan type: Forward Curved Centrifugal Fan Model no.: HF133-072D024H HF133-072D048H Rated Voltage: 24VDC 48VDC Impeller Size: Ø133*66mm Rated Speed: 2300RPM Air Flow: ...
Company: Heko Electronic (Suzhou) Co., Ltd.
23327. Heko DC133mm Wood Chip Suction Hydroponics High Temperature Centrifugal Dust Extraction Fan [Oct 10, 2024]
[Oct 10, 2024] Place of origin: Jiangsu, China Fan type: Forward Curved Centrifugal Fan Model no.: HF133-072D024H HF133-072D048H Rated Voltage: 24VDC 48VDC Impeller Size: Ø133*66mm Rated Speed: 2300RPM Air Flow: ...
Company: Heko Electronic (Suzhou) Co., Ltd.
23328. Dedicated to IGBT High Precision Die Bonding Machine [Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23329. Die Bonder Multiple Workbenches Combined with Precise Force Control Suitable Dispensing Machine [Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23330. Semiconductor High-Precision Die Bonder Machine Made in China [Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23331. High Precision Eutectic Machine for Semiconductor Chips [Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23332. Solid Crystal Flip Chip Multi Chip Packaging Multifunctional Integrated Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23333. High Precision Solid Crystal Mounting Machine for Multi Chip Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23334. Fully Automatic High-Precision Mounter Intelligent Calibration and Data Management System [Nov 24, 2023]
[Nov 24, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23335. High Precision Eutectic Machine Products Are Widely Used [Nov 23, 2023]
[Nov 23, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23336. Automatic Solder Machine Die Bonder Factory China [Nov 23, 2023]
[Nov 23, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23337. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23338. High Precision R&D Using Small Die Bonder Can Reach Die Bonder [Nov 22, 2023]
[Nov 22, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23339. Integrated Multi-Functional Patch Solidifying Machine Such as Dispensing and Hot Pressing [Nov 21, 2023]
[Nov 21, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23340. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
