Jiangsu Profile
Product List
23341. Multi-Function Manual Die Bonder Chip Solidification Machine 
[Nov 17, 2023]
[Nov 17, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23342. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23343. Multi-Functional, Fully Automatic and High-Precision Die Bonding Machine Chip Flip Welding Machine [Nov 15, 2023]
[Nov 15, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23344. High Precision Eutectic Die Bonder with Automatic Dispensing System [Nov 14, 2023]
[Nov 14, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23345. High Precision Flipchip Bonding Machine with Die Attach System [Nov 13, 2023]
[Nov 13, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23346. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23347. High Precision Eutectic Bonding Machine [Nov 06, 2023]
[Nov 06, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23348. Supply Automatic High Precision Equipment [Nov 06, 2023]
[Nov 06, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23349. High Precision Eutectic &Exopy Die Attach Chip Solder Machine [Nov 06, 2023]
[Nov 06, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23350. Submicron Placement Accuracy Attach Equipment [Nov 03, 2023]
[Nov 03, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23351. Automatic and Highly Precise Die Attach Equipment Multi-Chip Packaging [Nov 01, 2023]
[Nov 01, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23352. Chip Bonding Machine Die Bonder PCB Assembly Machine [Nov 01, 2023]
[Nov 01, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23353. High Precision Die Bonding Dispensing Robot Machine [Oct 27, 2023]
[Oct 27, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23354. High Precision Die Bonding and Epoxy Dispensing Systems Machine [Oct 25, 2023]
[Oct 25, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23355. Customized Service Automatic Eutectic Die Bonding Machine [Oct 24, 2023]
[Oct 24, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
