Jiangsu Profile
Product List
3796. Advanced Wafer Bonding System with Live Monitoring Capabilities for Semiconductor Manufacturing 
[Oct 26, 2026]
[Oct 26, 2026] Product Description Feature / Parameter EVG®501 Wafer Bonding System EVG®510 Wafer Bonding System Target Application Optimum TCO for R&D and pilot-line production Lowest TCO for R&D and pilot-line production Wafer Size ...
3797. High Precision Semiconductor Wafer Bonder for Advanced Die Bonding Equipment [Oct 26, 2026]
[Oct 26, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm ...
3798. Advanced Precision System for Wafer Bonding in High-Tech Applications [Nov 03, 2026]
[Nov 03, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
3799. High-Precision Automatic Die Bonding Machine for Semiconductor Applications [Sep 28, 2026]
[Sep 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
3800. High-Performance Thermal Bonding Equipment for to-220 and to-263 [Sep 28, 2026]
[Sep 28, 2026] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This soft solder die bonder realizes high-speed and high-precision semiconductor IC chip mounting on designated pad ...
3801. Precision Die Bonding Equipment for Advanced Eutectic Applications and Semiconductor Assembly [Oct 19, 2026]
[Oct 19, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
3802. High Precision Die Bonder for Semiconductor Assembly Solutions and Production Equipment [Oct 19, 2026]
[Oct 19, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
3803. Advanced Chip Assembly Wafer Bonder for Precision Semiconductor Manufacturing [Oct 19, 2026]
[Oct 19, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
3804. Ultra Bright P10 Outdoor LED Advertising Display Screen for Business Promotion [Oct 26, 2026]
[Oct 26, 2026] Product Description Outdoor led module 1.Unique mask design, dark black color, high contrast. 2.Module size 320*160mm. 3.Symmetrical and uniform, sturdy and flat. 4.The module adopts SMD1415 lamp, which has the ...
Company: Wuxi Xingzhida Technology Co., Ltd.
3805. Ultra Bright Motion Sensor RGB Solar Garden Stake Light [Nov 03, 2026]
[Nov 03, 2026] Company Profile DDK Electrical Technology Yangzhou Co., Ltd. DDK is a lighting and clean energy manufacturer from Yangzhou, China. We have over 10 years of industry experience. Our factory covers an area of 23,000 ...
3806. Anti-Corrosion Structure Industrial Fryer System Multi Heating Options Potato Chips Line [Oct 20, 2026]
[Oct 20, 2026] Product Description Continuous Frying Machine The frying machine is widely used in the food processing industry for frying all kinds of snacks, nuts, meat products, and fried vegetables. The machine adopts advanced ...
3807. Continuous Conveying Food Grade Steel Frame Automatic Frying Machine [Oct 20, 2026]
[Oct 20, 2026] Product Description Continuous Frying Machine The frying machine is widely used in the food processing industry for frying all kinds of snacks, nuts, meat products, and fried vegetables. The machine adopts advanced ...
3808. Customizable Energy Saving Oil Filter Frying Machine for Production [Oct 20, 2026]
[Oct 20, 2026] Product Description Continuous Frying Machine The frying machine is widely used in the food processing industry for frying all kinds of snacks, nuts, meat products, and fried vegetables. The machine adopts advanced ...
3809. Customizable Oil Filter Frying Machine with Polished Steel Surface for Potato Processing [Oct 20, 2026]
[Oct 20, 2026] Product Description Continuous Frying Machine The frying machine is widely used in the food processing industry for frying all kinds of snacks, nuts, meat products, and fried vegetables. The machine adopts advanced ...
3810. Stable Running Automatic Continuous Frying Machine with Horizontal Structure for Production [Oct 20, 2026]
[Oct 20, 2026] Product Description Continuous Frying Machine The frying machine is widely used in the food processing industry for frying all kinds of snacks, nuts, meat products, and fried vegetables. The machine adopts advanced ...
