Jiangsu Profile
Product List
3841. Solar LED Street Light with Die Cast Aluminum Alloy for Philippines 
[Oct 23, 2026]
[Oct 23, 2026] DIRECT-FROM-FACTORY SUPPLIER Specializing in: Integrated solar street lights (flagship model XM-SSL004), LED street lights, landscape lights, high-mast lights, and hot-dip galvanized light poles—ideal for comprehensive ...
Company: Yangzhou Synlumi Lighting Co., Ltd
3842. Durable Solar LED Street Light with Die Cast Aluminum Alloy for Nigeria [Oct 23, 2026]
[Oct 23, 2026] DIRECT-FROM-FACTORY SUPPLIER Specializing in: Integrated solar street lights (flagship model XM-SSL004), LED street lights, landscape lights, high-mast lights, and hot-dip galvanized light poles—ideal for comprehensive ...
Company: Yangzhou Synlumi Lighting Co., Ltd
3843. 100W Reliable Solar LED Street Light with Die Cast Aluminum Alloy Build [Oct 23, 2026]
[Oct 23, 2026] DIRECT-FROM-FACTORY SUPPLIER Specializing in: Integrated solar street lights (flagship model XM-SSL004), LED street lights, landscape lights, high-mast lights, and hot-dip galvanized light poles—ideal for comprehensive ...
Company: Yangzhou Synlumi Lighting Co., Ltd
3844. Contemporary Solar LED Street Light with Aluminum Alloy Body for Avenue [Oct 23, 2026]
[Oct 23, 2026] DIRECT-FROM-FACTORY SUPPLIER Specializing in: Integrated solar street lights (flagship model XM-SSL004), LED street lights, landscape lights, high-mast lights, and hot-dip galvanized light poles—ideal for comprehensive ...
Company: Yangzhou Synlumi Lighting Co., Ltd
3845. Kitchen Equipment Electric Deep Fryer High Performance Restaurant Deep Fryer Machine [Sep 29, 2026]
[Sep 29, 2026] The Introduction of the Pressure Chicken Fryer: An American-style pressure chicken fryer is a specialized frying device with a sealed pressure cooker lid. Its core principle is to enhance the cooking environment through ...
3846. Advanced Wafer Bonding System with Live Monitoring Capabilities for Semiconductor Manufacturing [Oct 26, 2026]
[Oct 26, 2026] Product Description Feature / Parameter EVG®501 Wafer Bonding System EVG®510 Wafer Bonding System Target Application Optimum TCO for R&D and pilot-line production Lowest TCO for R&D and pilot-line production Wafer Size ...
3847. High Precision Semiconductor Wafer Bonder for Advanced Die Bonding Equipment [Oct 26, 2026]
[Oct 26, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm ...
3848. Advanced Precision System for Wafer Bonding in High-Tech Applications [Nov 03, 2026]
[Nov 03, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
3849. High-Precision Automatic Die Bonding Machine for Semiconductor Applications [Sep 28, 2026]
[Sep 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
3850. High-Performance Thermal Bonding Equipment for to-220 and to-263 [Sep 28, 2026]
[Sep 28, 2026] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This soft solder die bonder realizes high-speed and high-precision semiconductor IC chip mounting on designated pad ...
3851. Precision Die Bonding Equipment for Advanced Eutectic Applications and Semiconductor Assembly [Oct 19, 2026]
[Oct 19, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
3852. High Precision Die Bonder for Semiconductor Assembly Solutions and Production Equipment [Oct 19, 2026]
[Oct 19, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
3853. Advanced Chip Assembly Wafer Bonder for Precision Semiconductor Manufacturing [Oct 19, 2026]
[Oct 19, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
3854. Ultra Bright P10 Outdoor LED Advertising Display Screen for Business Promotion [Oct 26, 2026]
[Oct 26, 2026] Product Description Outdoor led module 1.Unique mask design, dark black color, high contrast. 2.Module size 320*160mm. 3.Symmetrical and uniform, sturdy and flat. 4.The module adopts SMD1415 lamp, which has the ...
Company: Wuxi Xingzhida Technology Co., Ltd.
3855. Ultra Bright Motion Sensor RGB Solar Garden Stake Light [Nov 03, 2026]
[Nov 03, 2026] Company Profile DDK Electrical Technology Yangzhou Co., Ltd. DDK is a lighting and clean energy manufacturer from Yangzhou, China. We have over 10 years of industry experience. Our factory covers an area of 23,000 ...
