Jiangsu Profile
Product List
4741. 680V/12A 0.8mΩ Zg12n65 N-Channel Advanced Power Mosfet 
[Oct 26, 2022]
[Oct 26, 2022] ZG12N65 is an N-channel enhancement mode MOSFET, which is produced using Zhongxin Micro-electronics's proprietary. The self-aligned planar process and improved terminal technology reduce the conduction loss, improve ...
4742. Automatic Chocolate Chip Making Machine Depositor [May 05, 2021]
[May 05, 2021] Chocolate Chips Depositing Machine Product Description Gusu Chocolate Chip Depositor allows for the deposit of chocolate and chocolate compound drops and chips in a variety of shapes and weights, ranging from 0.1 to 5 ...
4743. High-Quality Waterproof LED Street Light at Competitive Prices [Aug 27, 2025]
[Aug 27, 2025] Product Description Item Item Origin Manufacturer Material Die-casting Aluminum Pole 4m/5m/6m/7m/8m/9m/10m/11m/12m Power 60W/90W/120w/150w/180w Power Adjustment Power adjustment in time segments Charging ...
Company: Jiangsu Zhongyao Photoelectric Technology Co., Ltd.
4744. Heavy Duty Cast Iron Briquette Machine for Metal Shavings [Aug 19, 2025]
[Aug 19, 2025] Vertical Hydraulic Metal Chip Briquetting Machine/Aluminum Chip Briquette Press Machine Production detail: Hydraulic scrap metal chip briquetting press machine has good benefits for metal recycling ...
Company: Jiangyin Unite Top Heavy Industry Machinery Co., Ltd.
4745. Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder [Aug 18, 2025]
[Aug 18, 2025] Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding ...
4746. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Aug 18, 2025]
[Aug 18, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
4747. Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System [Aug 18, 2025]
[Aug 18, 2025] Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...
4748. Price of 35m Customized High Mast Light [Aug 15, 2025]
[Aug 15, 2025] Product Description Price of 35m Customized High Mast Light We Are Manufacturer Since 1998 We have over 15 years experience of manufacturing High Mast Lighting Poles. ...
Company: BAODE LIGHTING GROUP CO., LTD.
4749. Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment [Aug 15, 2025]
[Aug 15, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
4750. High-Speed Wafer Bonding Machine Clip Bonder with Automatic Glue Filling Function [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
4751. Made in China Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
4752. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
4753. Energy-Saving P2 LED Display for Cryptocurrency Trading & Transportation Hubs [Sep 03, 2025]
[Sep 03, 2025] Product Description Product Parameters Product model BTQ012 BTQ015 BTQ018 BTQ020 BTQ025 Pixel pitch (mm) 1.25 1.538 1.86 2.0 2.5 LED type SMD1010 SMD1212 SMD1515 SMD1515 SMD2121 Module resolution(points) 256×128 208×104 ...
Company: Nanjing Chechi Technology Co., Ltd.
4754. High Definition High Stability P1.5 Commercial LED Display [Sep 03, 2025]
[Sep 03, 2025] Product Description Product Parameters Product model BTQ012 BTQ015 BTQ018 BTQ020 BTQ025 Pixel pitch (mm) 1.25 1.538 1.86 2.0 2.5 LED type SMD1010 SMD1212 SMD1515 SMD1515 SMD2121 Module resolution(points) 256×128 208×104 ...
Company: Nanjing Chechi Technology Co., Ltd.
4755. UV Resistant High Stability P1.5 Wide Viewing LED Display [Sep 03, 2025]
[Sep 03, 2025] Product Description Product Parameters Product model BTQ012 BTQ015 BTQ018 BTQ020 BTQ025 Pixel pitch (mm) 1.25 1.538 1.86 2.0 2.5 LED type SMD1010 SMD1212 SMD1515 SMD1515 SMD2121 Module resolution(points) 256×128 208×104 ...
Company: Nanjing Chechi Technology Co., Ltd.
