Jiangsu Profile
Product List
4801. High Quality Ion Implanter Semiconductor Material Small Implanter 
[Dec 13, 2025]
[Dec 13, 2025] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
4802. Innovation Technologies Vacuum Ion Implantation System [Dec 13, 2025]
[Dec 13, 2025] Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
4803. Automatic PCB/PCBA Online Cutting Machine Cutting PVC Board/Plastic Board/PMMA Board [Dec 13, 2025]
[Dec 13, 2025] Automatic PCB/PCBA Online Cutting Machine Cutting PVC Board/Plastic Board/PMMA Board Product Description PCB/PCBA Online Cutting Machine is used for the cutting and separating of small and multi-connected ...
4804. Equipment Factory Rapid Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] Equipment factory Rapid wire bonding machine for production line Product Description Technical Specifications: Wire Bonding Capability Ultra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad Pitch Wire ...
4805. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
4806. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
4807. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
4808. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
4809. High-Speed Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] High-Speed Wire Bonding Machine for Production Line Product Description High-Performance Automatic Wire Bonder This equipment is a state-of-the-art automatic wire bonding machine designed for high-mix, high-volume ...
4810. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
4811. Wire Bonding Machine for Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Product Description Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. ...
4812. High Precision Automatic Die Bonding Machine for Semiconductors [Dec 13, 2025]
[Dec 13, 2025] High Precision Semiconductor manual COB Smart Die Bonding Machine Automatic Dispensing industrial equipment manufacturer Product Description High-Speed Clip Bonder & Die Attach System: A Unified Precision ...
4813. High-Speed Automatic Die Attach Equipment for Precision Bonding [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
4814. Stunning High-Definition Indoor LED Video Wall for Home Entertainment [Dec 09, 2025]
[Dec 09, 2025] Product Description Indoor led module 1.Unique mask design, dark black color, high contrast. 2.Module size 320*160mm. 3.Symmetrical and uniform, sturdy and flat. 4.The module has the characteristics of good heat ...
Company: Wuxi Xingzhida Technology Co., Ltd.
4815. Elegant LED Indoor Wedding Display with Custom Video Background [Dec 09, 2025]
[Dec 09, 2025] Product Description Indoor led module 1.Unique mask design, dark black color, high contrast. 2.Module size 320*160mm. 3.Symmetrical and uniform, sturdy and flat. 4.The module has the characteristics of good heat ...
Company: Wuxi Xingzhida Technology Co., Ltd.
