Jiangsu Profile
Product List
5026. Equipment Factory Rapid Wire Bonding Machine for Production Line 
[Feb 28, 2026]
[Feb 28, 2026] Equipment factory Rapid wire bonding machine for production line Product Description Technical Specifications: Wire Bonding Capability Ultra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad Pitch Wire ...
5027. Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
5028. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
5029. Advanced Die Bonding Machine for Diodes and Transistors [Feb 28, 2026]
[Feb 28, 2026] Diodes and transistors die bonding machine eutectic straight arm welding head die bonding machine sot sod patch equipment Product Description Product advantages This is a high-speed thermal bonder designed for thermal ...
5030. Advanced Precision Wire Bonder for High-Power Device Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x ...
5031. Innovation Technologies Vacuum Ion Implantation System [Feb 28, 2026]
[Feb 28, 2026] Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
5032. Precision Die Bonding Machine for High-Quality Soldering Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
5033. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
5034. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Feb 28, 2026]
[Feb 28, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
5035. High-Speed Automatic Die Attach Equipment for Precision Bonding [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
5036. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
5037. High Quality Ion Implanter Semiconductor Material Small Implanter [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
5038. High Efficiency Automatic PCB and PCBA Manufacturing Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description PCB/PCBA Online Cutting Machine is used for the cutting and separating of small and multi-connected PCBs, such as those used in mobile phones, digital cameras, GPS devices, PDAs, 5G ...
5039. Wire Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. ...
5040. OEM&ODM Aluminium Alloy Die Casting Module Parts Series Solar Street Light [Mar 05, 2026]
[Mar 05, 2026] Product Description 1.Two colors, adjustable mold design 2. Adopt high brightness ED chip 3. Large capacity deep cycle lithium battery, longer service life 4.High quality solar cells, small size, high ...
