Jiangsu Profile
Product List
5011. Lab-Grade Vibratory Dual-Disc Alpha 210 Speed Adjustment Metallographic Sample Grinding Polishing ... 
[Mar 19, 2025]
[Mar 19, 2025] Model Alpha-210 Blader Diameter 10ti (254mm) Speed 50-600rpm Direction CW/CCW Torque 10N·m Electrical Voltage/Frequency 220V/50Hz (1Ph/N/PE) Rated Power 1500W Rated ...
5012. Metallographic Grinding Polishing Machine Alpha 210 Speed Change Six Fixed Speed Metallographic ... [Mar 19, 2025]
[Mar 19, 2025] Model Alpha-210 Blader Diameter 10ti (254mm) Speed 50-600rpm Direction CW/CCW Torque 10N·m Electrical Voltage/Frequency 220V/50Hz (1Ph/N/PE) Rated Power 1500W Rated ...
5013. Alpha 210 Lab-Grade Vibratory Cutting Polishing Machine Metallurgical Polisher Grinder Dual-Wheel ... [Mar 19, 2025]
[Mar 19, 2025] Model Alpha-210 Blader Diameter 10ti (254mm) Speed 50-600rpm Direction CW/CCW Torque 10N·m Electrical Voltage/Frequency 220V/50Hz (1Ph/N/PE) Rated Power 1500W Rated ...
5014. 4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System [Mar 19, 2025]
[Mar 19, 2025] Product Description This device is suitable for the cutting scheme of SIC wafers Application field: Development of mature silicon carbide laser internal modification cutting equipment A high-precision and ...
5015. Visual Positioning Function Rapid Chip Laser Drilling Equipment for Tsv, Tgv, HDI [Mar 19, 2025]
[Mar 19, 2025] Product Description Product Features Customized ultra-fast picosecond / femtosecond lasers with low thermal effects Self-developed drilling process technology which meets different process requirements Excellent ...
5016. Intelligent Logistics Warehousing System Device Vertical Carousel Equipment Manufacturer [Mar 19, 2025]
[Mar 19, 2025] Intelligent Logistics Warehousing System device Vertical Carousel Equipment manufacturer Product Description Vertical carousel, with carrier as storage unit realizes logistical storage of "from articles to ...
5017. Fully Automatic Wafer Laser Slotting Equipment Customized for Wafer Laser Processing [Mar 19, 2025]
[Mar 19, 2025] This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates ...
5018. Electric Purification Furnace Device Magnetic Fer-Rite Drainage Exhausted Metal Handling Equipment [Mar 19, 2025]
[Mar 19, 2025] Electric Purification Furnace Magnetic Fer-rite Drainage exhausted metal handling equipment Product Description 1,Scope of application The organic waste gas flow rate is less than 200 Nm3/h; the general ...
5019. Silicon Wafer Laser Stealth Cutting Equipment Equipped with Laser Spot Shaping and Compensation ... [Mar 19, 2025]
[Mar 19, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with high precision dynamic focus tracking and compensation system to ensure the ...
5020. Long Life Fiber Laser High-Speed Marking Equipment for Various Discrete Devices [Mar 19, 2025]
[Mar 19, 2025] Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...
5021. High End Ceramic Punching Equipment with High Precision Laser Processing System [Mar 19, 2025]
[Mar 19, 2025] Product Description Introduction: High precision laser processing system: galvanometer+cutting head, integrated advantages Ø Dual workstation processing, improving efficiency Fully automatic loading and ...
5022. Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection [Mar 17, 2025]
[Mar 17, 2025] Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital ...
5023. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Mar 13, 2025]
[Mar 13, 2025] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
5024. High End Good Stability Automatic Laser Debonding Equipment [Mar 13, 2025]
[Mar 13, 2025] High End Good Stability Automatic Laser Debonding Equipment Product Description Fully automatic laser debonding equipment Adopting DPSS laser and professional laser debonding system DPSS laser with good ...
5025. High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head [Mar 12, 2025]
[Mar 12, 2025] High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
