Jiangsu Profile
Product List
8131. Wyk 4mm-12mm Diamond Coating Corn End Mill CNC Corn Milling Cutter for Processed Graphite 
[May 11, 2023]
[May 11, 2023] Our Advantages 1. A large number of standard stocks, the spot is fast. 2. Provide 24-hour pre-sales and after-sales service, reply within 3 minutes. 3. Ask customer service for free samples. 4.Undertake OEM ...
8132. Brush Stainless Steel Glass Bottle Salt Pepper Mills, Himalayan Pink Rock Salt Grinder [Feb 23, 2023]
[Feb 23, 2023] Description Item spice grinder, mill, salt and pepper grinder Usage pepper, chili, sesame, anise, salt and etc. Package · Standard export carton, pallet or customized · pallet ( size : ...
8133. 20W-100W Fiber Laser Marking Machine for Metal & Plastic with Ezcad2 Software [Oct 24, 2025]
[Oct 24, 2025] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a ...
8134. Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry [Oct 24, 2025]
[Oct 24, 2025] Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer application scenarios Provide cost-effective equipment solutions Application Automatic ...
8135. Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board [Oct 24, 2025]
[Oct 24, 2025] Product Description Our Automatic Dicing Saw Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...
8136. China High Speed Automatic Glue Dispenser Machine for LED Lens [Oct 24, 2025]
[Oct 24, 2025] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
8137. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Oct 22, 2025]
[Oct 22, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
8138. High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor [Oct 22, 2025]
[Oct 22, 2025] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...
8139. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Oct 22, 2025]
[Oct 22, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8140. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly [Oct 22, 2025]
[Oct 22, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
8141. Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience [Oct 20, 2025]
[Oct 20, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
8142. Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing [Oct 20, 2025]
[Oct 20, 2025] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
8143. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Oct 20, 2025]
[Oct 20, 2025] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
8144. High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head [Oct 20, 2025]
[Oct 20, 2025] High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
8145. Low-Dust Masterbatch Twin Screw Extruder for Plastics Coloring [Oct 14, 2025]
[Oct 14, 2025] Product Parameters Model Diameter (mm) L/D Screw speed (rpm) Motor Power (KW) Torque per shaft (N·m) Specific torque T/A3 Capacity (kg/hr) SM26plus 26.5 24~68 900 22 117 ...
Company: Sunmac Machinery Co., Ltd.
