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Wyk 4mm-12mm Diamond Coating Corn End Mill CNC Corn Milling Cutter for Processed Graphite
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8131.

Wyk 4mm-12mm Diamond Coating Corn End Mill CNC Corn Milling Cutter for Processed Graphite Open Details in New Window [May 11, 2023]

Our Advantages 1. A large number of standard stocks, the spot is fast. 2. Provide 24-hour pre-sales and after-sales service, reply within 3 minutes. 3. Ask customer service for free samples. 4.Undertake OEM ...

Company: Changzhou Weiyuke Hardware Tools Co., Ltd.

Brush Stainless Steel Glass Bottle Salt Pepper Mills, Himalayan Pink Rock Salt Grinder
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8132.

Brush Stainless Steel Glass Bottle Salt Pepper Mills, Himalayan Pink Rock Salt Grinder Open Details in New Window [Feb 23, 2023]

Description Item spice grinder, mill, salt and pepper grinder Usage pepper, chili, sesame, anise, salt and etc. Package · Standard export carton, pallet or customized · pallet ( size : ...

Company: Xuzhou Crystal Glass Products Co., Ltd.

20W-100W Fiber Laser Marking Machine for Metal & Plastic with Ezcad2 Software
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8133.

20W-100W Fiber Laser Marking Machine for Metal & Plastic with Ezcad2 Software Open Details in New Window [Oct 24, 2025]

Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry
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8134.

Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry Open Details in New Window [Oct 24, 2025]

Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer application scenarios Provide cost-effective equipment solutions Application Automatic ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board
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8135.

Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board Open Details in New Window [Oct 24, 2025]

Product Description Our Automatic Dicing Saw Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China High Speed Automatic Glue Dispenser Machine for LED Lens
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8136.

China High Speed Automatic Glue Dispenser Machine for LED Lens Open Details in New Window [Oct 24, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device
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8137.

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device Open Details in New Window [Oct 22, 2025]

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor
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8138.

High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor Open Details in New Window [Oct 22, 2025]

Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
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8139.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing Open Details in New Window [Oct 22, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
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8140.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly Open Details in New Window [Oct 22, 2025]

12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience
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8141.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience Open Details in New Window [Oct 20, 2025]

Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing
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8142.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing Open Details in New Window [Oct 20, 2025]

Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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8143.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Oct 20, 2025]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head
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8144.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Open Details in New Window [Oct 20, 2025]

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-Dust Masterbatch Twin Screw Extruder for Plastics Coloring
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8145.

Low-Dust Masterbatch Twin Screw Extruder for Plastics Coloring Open Details in New Window [Oct 14, 2025]

Product Parameters Model Diameter (mm) L/D Screw speed (rpm) Motor Power (KW) Torque per shaft (N·m) Specific torque T/A3 Capacity (kg/hr) SM26plus 26.5 24~68 900 22 117 ...

Company: Sunmac Machinery Co., Ltd.