Jiangsu Profile
Product List
8176. High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor 
[Oct 22, 2025]
[Oct 22, 2025] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...
8177. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Oct 22, 2025]
[Oct 22, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8178. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly [Oct 22, 2025]
[Oct 22, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
8179. Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience [Oct 20, 2025]
[Oct 20, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
8180. Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing [Oct 20, 2025]
[Oct 20, 2025] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
8181. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Oct 20, 2025]
[Oct 20, 2025] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
8182. High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head [Oct 20, 2025]
[Oct 20, 2025] High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
8183. Low-Dust Masterbatch Twin Screw Extruder for Plastics Coloring [Oct 14, 2025]
[Oct 14, 2025] Product Parameters Model Diameter (mm) L/D Screw speed (rpm) Motor Power (KW) Torque per shaft (N·m) Specific torque T/A3 Capacity (kg/hr) SM26plus 26.5 24~68 900 22 117 ...
Company: Sunmac Machinery Co., Ltd.
8184. Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control [Oct 16, 2025]
[Oct 16, 2025] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low ...
8185. 5W Flying Marking Machine for PE Bottle/PVC Pipe/Ceramics/Gift/Decorative/Package Bag [Oct 16, 2025]
[Oct 16, 2025] Product Description Brief Description UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. ...
8186. Gold Silver Jewelry Fiber Marking or Engraving Machine [Oct 16, 2025]
[Oct 16, 2025] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable ...
8187. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Oct 16, 2025]
[Oct 16, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8188. High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform [Oct 16, 2025]
[Oct 16, 2025] High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super ...
8189. Laser Industry-Leading Laser Wafer Marking for Semiconductor & Mems Manufacturingafer Marking ... [Oct 16, 2025]
[Oct 16, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
8190. PCB Laser Marking Systems for Electronics Manufacturing [Oct 16, 2025]
[Oct 16, 2025] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems provide ...
