Jiangsu Profile
Product List
14731. Advanced Electroplating Cleaning Machine for Precision Metal Finishing 
[Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
14732. Professional 355nm UV Laser Engraving Machine for Quality Results [Feb 28, 2026]
[Feb 28, 2026] UV laser marking system The UV laser marking system is characterized by its small size, low power consumption, long lifespan, high efficiency, and maintenance - free operation. It is convenient to install and carry. The ...
14733. High-Performance Sic Laser Annealing System for Wafer Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
14734. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
14735. Visual Glue Dispenser Machine Automatic CCD Three-Axis Desktop Dispensing Robot Equipment [Feb 28, 2026]
[Feb 28, 2026] Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning ...
14736. High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series) [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision ...
14737. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
14738. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
14739. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
14740. Professional High-Precision CO2 Laser Engraver for Custom Projects [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
14741. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
14742. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
14743. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
14744. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
14745. Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers [Feb 28, 2026]
[Feb 28, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
