Jiangsu Profile
Product List
14806. High-Precision UV and CO2 Laser Marking Machine for IC Packaging 
[Oct 31, 2025]
[Oct 31, 2025] UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and ...
14807. High-Performance 8-Inch/12-Inch Laser Wafer Marking System for Professionals [Oct 31, 2025]
[Oct 31, 2025] High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking. Features: 1. With the green ...
14808. High-Precision Infrared Green UV Laser Marking Machine for Wafers [Oct 31, 2025]
[Oct 31, 2025] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
14809. High-Precision Laser Marking Machine for Large PCBA Projects [Oct 31, 2025]
[Oct 31, 2025] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...
14810. Precision Laser Marking Machine for Electronics and Appliances [Oct 31, 2025]
[Oct 31, 2025] Automatic Focusing PCBA Laser Marking Machine for Household Appliances/Office Equipment Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...
14811. High-Precision Automatic Die Bonder for LED Packaging Solutions [Oct 31, 2025]
[Oct 31, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
14812. High-Precision UV Laser Marking Machine for Wafer Circuit Boards [Oct 31, 2025]
[Oct 31, 2025] Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser ...
14813. Advanced UV and CO2 Laser Marking Machine for PCBA Boards [Oct 31, 2025]
[Oct 31, 2025] UV/CO2 Laser Marking Machine on The Rigid and Flexible Printed Circuit Board PCBA Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC ...
14814. High-Precision Green Laser Marking Machine for Digital Products [Oct 31, 2025]
[Oct 31, 2025] Green Laser Marking Machine On Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel Product Description Brief Description The equipment can realize automatic loading and unloading for ...
14815. Advanced CO2 Laser Engraving Machine for PCB and Ceramics [Oct 31, 2025]
[Oct 31, 2025] Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...
14816. High-Precision CO2 Laser Engraver for Food Packaging Solutions [Oct 31, 2025]
[Oct 31, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
14817. Advanced Fully Automated Custom Laser Marking Machine for Assembly Lines [Oct 31, 2025]
[Oct 31, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
14818. High-Precision CO2 Laser Engraving Machine for Textiles and Crafts [Oct 31, 2025]
[Oct 31, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
14819. High Precision COB Die Bonding Machine with Auto Dispensing [Oct 31, 2025]
[Oct 31, 2025] Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...
14820. Fully Automatic Precision Cutting Machine [Oct 31, 2025]
[Oct 31, 2025] Product Description Compact Single-Station Adhesive Film Laying Machine This machine is an advanced, space-efficient solution for automatically cutting and laying adhesive film onto glass or other surfaces. ...
