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High-Precision UV and CO2 Laser Marking Machine for IC Packaging
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14806.

High-Precision UV and CO2 Laser Marking Machine for IC Packaging Open Details in New Window [Oct 31, 2025]

UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance 8-Inch/12-Inch Laser Wafer Marking System for Professionals
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14807.

High-Performance 8-Inch/12-Inch Laser Wafer Marking System for Professionals Open Details in New Window [Oct 31, 2025]

High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking. Features: 1. With the green ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Infrared Green UV Laser Marking Machine for Wafers
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14808.

High-Precision Infrared Green UV Laser Marking Machine for Wafers Open Details in New Window [Oct 31, 2025]

Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Marking Machine for Large PCBA Projects
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14809.

High-Precision Laser Marking Machine for Large PCBA Projects Open Details in New Window [Oct 31, 2025]

Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Marking Machine for Electronics and Appliances
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14810.

Precision Laser Marking Machine for Electronics and Appliances Open Details in New Window [Oct 31, 2025]

Automatic Focusing PCBA Laser Marking Machine for Household Appliances/Office Equipment Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automatic Die Bonder for LED Packaging Solutions
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14811.

High-Precision Automatic Die Bonder for LED Packaging Solutions Open Details in New Window [Oct 31, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Marking Machine for Wafer Circuit Boards
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14812.

High-Precision UV Laser Marking Machine for Wafer Circuit Boards Open Details in New Window [Oct 31, 2025]

Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced UV and CO2 Laser Marking Machine for PCBA Boards
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14813.

Advanced UV and CO2 Laser Marking Machine for PCBA Boards Open Details in New Window [Oct 31, 2025]

UV/CO2 Laser Marking Machine on The Rigid and Flexible Printed Circuit Board PCBA Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Green Laser Marking Machine for Digital Products
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14814.

High-Precision Green Laser Marking Machine for Digital Products Open Details in New Window [Oct 31, 2025]

Green Laser Marking Machine On Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel Product Description Brief Description The equipment can realize automatic loading and unloading for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced CO2 Laser Engraving Machine for PCB and Ceramics
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14815.

Advanced CO2 Laser Engraving Machine for PCB and Ceramics Open Details in New Window [Oct 31, 2025]

Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraver for Food Packaging Solutions
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14816.

High-Precision CO2 Laser Engraver for Food Packaging Solutions Open Details in New Window [Oct 31, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fully Automated Custom Laser Marking Machine for Assembly Lines
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14817.

Advanced Fully Automated Custom Laser Marking Machine for Assembly Lines Open Details in New Window [Oct 31, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraving Machine for Textiles and Crafts
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14818.

High-Precision CO2 Laser Engraving Machine for Textiles and Crafts Open Details in New Window [Oct 31, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision COB Die Bonding Machine with Auto Dispensing
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14819.

High Precision COB Die Bonding Machine with Auto Dispensing Open Details in New Window [Oct 31, 2025]

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Precision Cutting Machine
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14820.

Fully Automatic Precision Cutting Machine Open Details in New Window [Oct 31, 2025]

Product Description Compact Single-Station Adhesive Film Laying Machine This machine is an advanced, space-efficient solution for automatically cutting and laying adhesive film onto glass or other surfaces. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.