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355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB
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11056.

355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB Open Details in New Window [Feb 28, 2026]

Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC
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11057.

30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC Open Details in New Window [Feb 28, 2026]

Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Fiber Laser Marking Machine for Packaging Solutions
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11058.

High-Precision Fiber Laser Marking Machine for Packaging Solutions Open Details in New Window [Feb 28, 2026]

Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Silicon Bonding Equipment for Semiconductor Production Solutions
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11059.

Advanced Silicon Bonding Equipment for Semiconductor Production Solutions Open Details in New Window [Feb 28, 2026]

Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Dispensing Robot: Our glue ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing
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11060.

Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Open Details in New Window [Feb 28, 2026]

Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
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11061.

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms Open Details in New Window [Feb 28, 2026]

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs
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11062.

High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs Open Details in New Window [Feb 28, 2026]

Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting
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11063.

High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting Open Details in New Window [Feb 28, 2026]

Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automated Laser Marking System for Industrial Use
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11064.

High-Precision Automated Laser Marking System for Industrial Use Open Details in New Window [Feb 28, 2026]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Engraving Machine for Metal and Plastic
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11065.

High-Precision UV Laser Engraving Machine for Metal and Plastic Open Details in New Window [Feb 28, 2026]

UV Laser Marking Machine on Metal Glass Cup Plastic Rubber Leather Water Bottle Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Food Safety Laser Marking Machine for Brand Integrity
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11066.

Advanced Food Safety Laser Marking Machine for Brand Integrity Open Details in New Window [Feb 28, 2026]

Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraving Machine for Wood and Plastic
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11067.

High-Precision CO2 Laser Engraving Machine for Wood and Plastic Open Details in New Window [Feb 28, 2026]

Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Marking Machine for Glass & Silica
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11068.

High-Precision UV Laser Marking Machine for Glass & Silica Open Details in New Window [Feb 28, 2026]

Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Cutting Machine with Advanced CCD Positioning
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11069.

High-Precision Laser Cutting Machine with Advanced CCD Positioning Open Details in New Window [Feb 28, 2026]

Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal
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11070.

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Open Details in New Window [Feb 28, 2026]

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.