Jiangsu Profile
Product List
11101. High-Precision 355nm 3W UV Laser Engraving Machine with Safety Features 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
11102. Advanced Fully Automatic Laser Marking Machine for Wafer ID [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...
11103. High-Precision UV Laser Cutter for Automotive Circuit Board Production [Feb 28, 2026]
[Feb 28, 2026] PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the ...
11104. High-Precision 15W UV Laser Cutter for Wafer Automation [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, ...
11105. Smema Compliant Hdz-PCB100: Fully Automatic Inline PCB Laser Marking Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Maximize PCB Traceability & Efficiency with the LASER PCB100 Laser Marking Machine In the precise world of printed circuit board (PCB) manufacturing, every detail matters-especially permanent, ...
11106. 355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB [Feb 28, 2026]
[Feb 28, 2026] Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...
11107. 30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC [Feb 28, 2026]
[Feb 28, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...
11108. High-Precision Fiber Laser Marking Machine for Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...
11109. Advanced Silicon Bonding Equipment for Semiconductor Production Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Dispensing Robot: Our glue ...
11110. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Feb 28, 2026]
[Feb 28, 2026] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
11111. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
11112. High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...
11113. High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
11114. High-Precision Automated Laser Marking System for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
11115. High-Precision UV Laser Engraving Machine for Metal and Plastic [Feb 28, 2026]
[Feb 28, 2026] UV Laser Marking Machine on Metal Glass Cup Plastic Rubber Leather Water Bottle Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
