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Automatic High Precision Cost Efficient Dispersion Glue Machine with Vision CCD
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8656.

Automatic High Precision Cost Efficient Dispersion Glue Machine with Vision CCD Open Details in New Window [Feb 28, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Direct Supplied Silicone Adhesive Gluing Dispenser Machine for Assembly Line
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8657.

Factory Direct Supplied Silicone Adhesive Gluing Dispenser Machine for Assembly Line Open Details in New Window [Feb 28, 2025]

Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine
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8658.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine Open Details in New Window [Feb 28, 2025]

Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine
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8659.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine Open Details in New Window [Feb 28, 2025]

Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
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8660.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China Open Details in New Window [Feb 26, 2025]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making
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8661.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System
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8662.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Direct Sales Qfn Testing and Sorting Machine (Packaging size 3mmx3mmw~50mmx50mm)
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8663.

Factory Direct Sales Qfn Testing and Sorting Machine (Packaging size 3mmx3mmw~50mmx50mm) Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1&times;4 mode Test mode Room temperature Material handling cart Supports ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing
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8664.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1&times;4 mode Test mode Room temperature Material handling cart Supports ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine
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8665.

High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Speed and High Precision Spraying Precise Coating Machine for Complex Parts/Variable Parts
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8666.

High Speed and High Precision Spraying Precise Coating Machine for Complex Parts/Variable Parts Open Details in New Window [Feb 25, 2025]

Product Description 1. Multi-directional and multi-angle spraying process - solve the problem of high-part dead-angle spraying; 2. Wide applicability - suitable for complex parts, variable parts, high speed and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
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8667.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop Open Details in New Window [Feb 25, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: &plusmn;10-15&mu;m@3&sigma;; Die attach mode: &plusmn;10-25&mu;m@3&sigma;; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Efficiency HDPE PE PP PPR Pipe Production Line Extruder Machine
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8668.

High Efficiency HDPE PE PP PPR Pipe Production Line Extruder Machine Open Details in New Window [Feb 24, 2025]

Product Description 16-110 PPR/PPH HDPE Pipe Making Machine Production Line This Extrusion Line can be used for different diameter PPR PPH HDPE Pipe production which have excellent stiffness and flexibility, heat ...

Company: Zhangjiagang City Qiangsheng Plastic Machinery Co., Ltd.

Metal Surface Grinding Machine Original Manufacturer 250ahd
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8669.

Metal Surface Grinding Machine Original Manufacturer 250ahd Open Details in New Window [Feb 20, 2025]

The product is a carriage moving surface grinder, which mainly uses the periphery of the grinding wheel to grind the plane of the workpiece and the end face of the grinding wheel to grind the vertical surface of the ...

Company: Suzhou Talent Import and Export Co., Ltd.

Hot Sale Hydraulic Surface Vertical Metal Grinding Machine 3060ahd
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8670.

Hot Sale Hydraulic Surface Vertical Metal Grinding Machine 3060ahd Open Details in New Window [Feb 20, 2025]

The product is a carriage moving surface grinder, which mainly uses the periphery of the grinding wheel to grind the plane of the workpiece and the end face of the grinding wheel to grind the vertical surface of the ...

Company: Suzhou Talent Import and Export Co., Ltd.