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Flush Runner Residual Glue Machine with Light Curtain Protection and Safety Door Protection Device
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8686.

Flush Runner Residual Glue Machine with Light Curtain Protection and Safety Door Protection Device Open Details in New Window [Sep 18, 2025]

Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
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8687.

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine Open Details in New Window [Sep 18, 2025]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
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8688.

Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach Open Details in New Window [Sep 18, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Price Precision Laser Drilling Machine for Thin Film/Hard and Brittle Materials
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8689.

Factory Price Precision Laser Drilling Machine for Thin Film/Hard and Brittle Materials Open Details in New Window [Sep 18, 2025]

Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
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8690.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine Open Details in New Window [Sep 18, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Glass Cutting & Lobing Machine for Digital 3D Front Andback Cover Glass
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8691.

Glass Cutting & Lobing Machine for Digital 3D Front Andback Cover Glass Open Details in New Window [Sep 18, 2025]

Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and reliable Self-developed cutting process technology patent, excellent kerf quality, no surface damage High ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Circuit Boards/Packaging IC Carrier Boardprecision Cutting and Post-Cutting Machine
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8692.

Circuit Boards/Packaging IC Carrier Boardprecision Cutting and Post-Cutting Machine Open Details in New Window [Sep 18, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Quartz Boat Loading and Unloading Machine for Diffusion and Annealing Processes
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8693.

Quartz Boat Loading and Unloading Machine for Diffusion and Annealing Processes Open Details in New Window [Sep 18, 2025]

Product Description G Texturing And Etching Automatic Loading And Unloading Machine Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process Main Technical Parameter Capacity(2 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic UV Laser Cutting Machine for Mobile Phone Fingerprint Module/Camera Module
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8694.

Automatic UV Laser Cutting Machine for Mobile Phone Fingerprint Module/Camera Module Open Details in New Window [Sep 18, 2025]

Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Debonding Machine with Real-Time Monitoring/ Automatic Compensation/ Ensuring Process ...
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8695.

Laser Debonding Machine with Real-Time Monitoring/ Automatic Compensation/ Ensuring Process ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Drilling/Cutting/Scribing/Slotting Machine for PCB/FPC/RF/Touch ...
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8696.

Automatic Drilling/Cutting/Scribing/Slotting Machine for PCB/FPC/RF/Touch ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Wafer Film Sticking Machine with Stripping and Cleaning Functions
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8697.

Fully Automatic Wafer Film Sticking Machine with Stripping and Cleaning Functions Open Details in New Window [Sep 18, 2025]

Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry
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8698.

Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry Open Details in New Window [Sep 18, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Metal Horizontal CNC Boring Machine Milling Machine
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8699.

High Precision Metal Horizontal CNC Boring Machine Milling Machine Open Details in New Window [Sep 17, 2025]

Product Description Function, Features & Parameter Function & Features Description Main Function TPX6111B series digital display horizontal milling and boring machine. Its excellent products can be widely used in ...

Company: SJR Machinery Limited

Automatic Ring Lock Scaffold Metal Parts Welding Fully Automatic Welding Machine Suitable
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8700.

Automatic Ring Lock Scaffold Metal Parts Welding Fully Automatic Welding Machine Suitable Open Details in New Window [Sep 06, 2025]

Welcome to CONCELA About CONCELA Founded in 2015, Suzhou Concela Automation is located in Suzhou Xiangcheng Economic Development Zone, No. 777, Kangyuan Road, 4 kilometers away from Suzhou North High-speed Railway ...

Company: Suzhou Concela Automation Technologies Co.,Ltd