Jiangsu Profile
Product List
18586. Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control 
[Dec 13, 2025]
[Dec 13, 2025] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...
18587. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18588. Premium Fmj Series High-Temperature Furnace for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
18589. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
18590. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Dec 13, 2025]
[Dec 13, 2025] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
18591. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Dec 13, 2025]
[Dec 13, 2025] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
18592. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18593. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18594. Manual Semi Automatic Aluminum or Gold Desktop Wire Bonders with Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
18595. Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18596. 1900 Series Precision and Stability Lithography Equipment for Advanced Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Product Description 1900 Series Advanced Lithography Equipment - Overview The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a ...
18597. Advanced High-Precision Laser Trimming Machine for LED Displays [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
18598. High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...
18599. Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer application scenarios Provide cost-effective equipment solutions Application Automatic ...
18600. High-Efficiency Vocs Catalytic Combustion System for Spray Painting [Dec 13, 2025]
[Dec 13, 2025] Vocs Catalytic Combustion for Spray Painting machine glue Coating Rotary Printing Chemical Production industrial equipment Product Description 1,Scope of application The organic waste gas flow rate is 1000 ...
