Jiangsu Profile
Product List
18616. High Precision Sheet Metal Fabrication Stamping Part for SUS/Aluminium Material 
[Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18617. Advanced Laser Debonding Technology for Rapid Industrial Solutions [Mar 02, 2026]
[Mar 02, 2026] Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...
18618. Advanced Electroplating Cleaning Machine for Precision Metal Finishing [Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
18619. High-Performance Sic Laser Annealing System for Wafer Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18620. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
18621. High Precision Single Mode Alignment System [Feb 28, 2026]
[Feb 28, 2026] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
18622. Tgv High Yield Precision Cutting Laser Drilling Equipment [Feb 28, 2026]
[Feb 28, 2026] Tgv High Yield Precision Cutting Laser Drilling Equipment Product Description TGV High Yield Precision Cutting Laser Drilling Equipment Product Overview This TGV (Through Glass Via) laser drilling equipment is ...
18623. Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...
18624. Advanced Qt-8200 Mixed Signal Tester for Precision Measurements [Feb 28, 2026]
[Feb 28, 2026] Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly electronics; ...
18625. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18626. High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System [Feb 28, 2026]
[Feb 28, 2026] Deep Reactive Ion etching of Silicon ICP Etcher The ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible ...
18627. Efficient Industrial Splintering with Advanced Silicon Carbide Technology [Feb 28, 2026]
[Feb 28, 2026] Silicon Carbide High Temperature Splintering Furnace and Industrial Furnace industrial equipment Product Description Certification ISO Warranty 1 year Automatic ...
18628. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
18629. 8-Inch Stainless Steel Wafer Frame Dicing Ring for Semiconductor Use [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18630. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
