Jiangsu Profile
Product List
10186. Multi-Station Vertical Semiconductor Wafer Dryer 
[Dec 13, 2025]
[Dec 13, 2025] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
10187. High-Precision 15W/20W UV Nanosecond Laser for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description Encapsulation in hundred class ultra clean laboratory Good beam quality(M²<1.3) High stability for long term running, 24/7 industrial application Compact structure and low power ...
10188. Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing [Dec 13, 2025]
[Dec 13, 2025] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
10189. High-Precision FPCB Laser Cutting and Placement System for Production [Dec 13, 2025]
[Dec 13, 2025] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...
10190. Automatic Mobile Device Glass Cutting and Scribing Tool [Dec 13, 2025]
[Dec 13, 2025] Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...
10191. Advanced High-Precision Laser Marking System for PCB Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...
10192. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
10193. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
10194. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
10195. Ultra-Fast Picosecond Laser Glass Cutting and Lobing Machine [Dec 13, 2025]
[Dec 13, 2025] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
10196. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
10197. Hot Sales Fiber CO2 Laser Marking Machine with Split Type Compact Design [Dec 13, 2025]
[Dec 13, 2025] Product Description Himalaya Semiconductor Split-type CO2 Laser Marking Machine | Precision & Versatility Experience the perfect blend of precision, power, and flexibility with the Himalaya Semiconductor Split-type CO2 ...
10198. Advanced Interactive Laser Cutting Machine with Real-Time Feedback [Dec 13, 2025]
[Dec 13, 2025] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
10199. High Precision Laser Cutting Machine for Marble Platforms [Dec 13, 2025]
[Dec 13, 2025] High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super ...
10200. 465W Solar Panel 23.7 Kg Weight for Roofs with Low Weight Tolerance [Dec 10, 2025]
[Dec 10, 2025] Product Description Delivers Reliable Performance Over Time Improved Temperature Coefficient: One of the real-world challenges for solar panels is that their efficiency drops as they get hot. PERC cells typically have a ...
Company: Wuxi Taoistic New Energy Co., Ltd.
