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Optical Lens Laser Protective Window High Power Laser Cut Lens
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10231.

Optical Lens Laser Protective Window High Power Laser Cut Lens Open Details in New Window [Nov 26, 2025]

Manufacture custom Diameter 1-300mm optical sapphire BK7 Quartz coated optical window we are manufacturer of optical glass lens ,prisms ,spherical lens ,aspherical lens ,cylindrical lens ,optical window plate ...

Company: C-Laser (Taicang) Material Technology Co., Ltd.

99.99% Purity IR Infrared Material No Polished Si Window Silicon Window
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10232.

99.99% Purity IR Infrared Material No Polished Si Window Silicon Window Open Details in New Window [Nov 25, 2025]

Manufacture custom Diameter 1-300mm optical window A silicon window is an optical element that allows light to pass through without scattering or diffracting. Our products are widely used in laser marking, engraving, ...

Company: C-Laser (Taicang) Material Technology Co., Ltd.

Germanium Infrared Optical Ge Windows Lens Custom Optics Substrate
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10233.

Germanium Infrared Optical Ge Windows Lens Custom Optics Substrate Open Details in New Window [Nov 25, 2025]

Manufacture custom Diameter 1-300mm optical window Germanium material has a high refractive index (about 4.0 at 2-14μm band), and can be coated to improve the transmittance of the corresponding band when used as window ...

Company: C-Laser (Taicang) Material Technology Co., Ltd.

Coated Bandpass Filters Laser Blue High-Transmission 470 Narrow Band IR Cutoff Filter
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10234.

Coated Bandpass Filters Laser Blue High-Transmission 470 Narrow Band IR Cutoff Filter Open Details in New Window [Dec 16, 2025]

C-laser High-Precision Interference Filter - Vacuum-Coated Optical Core Component C-laser's interference filter is a cutting-edge light control solution engineered for high-end optical equipment, delivering unparalleled ...

Company: C-Laser (Taicang) Material Technology Co., Ltd.

Advanced Automatic Laser Drilling Machine for Glass and Ceramics
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10235.

Advanced Automatic Laser Drilling Machine for Glass and Ceramics Open Details in New Window [Dec 13, 2025]

Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Multi-Station Vertical Semiconductor Wafer Dryer
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10236.

Multi-Station Vertical Semiconductor Wafer Dryer Open Details in New Window [Dec 13, 2025]

Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision 15W/20W UV Nanosecond Laser for Industrial Applications
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10237.

High-Precision 15W/20W UV Nanosecond Laser for Industrial Applications Open Details in New Window [Dec 13, 2025]

Product Description Encapsulation in hundred class ultra clean laboratory Good beam quality(M&sup2;<1.3) High stability for long term running, 24/7 industrial application Compact structure and low power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing
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10238.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing Open Details in New Window [Dec 13, 2025]

Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision FPCB Laser Cutting and Placement System for Production
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10239.

High-Precision FPCB Laser Cutting and Placement System for Production Open Details in New Window [Dec 13, 2025]

High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Mobile Device Glass Cutting and Scribing Tool
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10240.

Automatic Mobile Device Glass Cutting and Scribing Tool Open Details in New Window [Dec 13, 2025]

Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High-Precision Laser Marking System for PCB Manufacturing
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10241.

Advanced High-Precision Laser Marking System for PCB Manufacturing Open Details in New Window [Dec 13, 2025]

High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Die Bonding Machine for PCB and IC Assembly
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10242.

High Precision Die Bonding Machine for PCB and IC Assembly Open Details in New Window [Dec 13, 2025]

Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic LED/IC Flip Chip Die Bonding Machine
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10243.

Automatic LED/IC Flip Chip Die Bonding Machine Open Details in New Window [Dec 13, 2025]

HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device
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10244.

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device Open Details in New Window [Dec 13, 2025]

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Ultra-Fast Picosecond Laser Glass Cutting and Lobing Machine
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10245.

Ultra-Fast Picosecond Laser Glass Cutting and Lobing Machine Open Details in New Window [Dec 13, 2025]

High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.