Jiangsu Profile
Product List
15226. Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate 
[Apr 02, 2026]
[Apr 02, 2026] Product Description 1.Customized optical JGS1 JGS2 Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate 2.Quartz plate/round quartz disc/quartz sight glass discperating temperature is ...
15227. Clear Semiconductor Further Process Quartz Glass Pipe [Apr 02, 2026]
[Apr 02, 2026] Product Description 1.Factory supply high purity Clear Semiconductor Heat Resistance Further Process Quartz Glass Pipe. 2. Quartz Glass Pipe has heating industry. Characteristics of Quartz Glass Tube: 1) ...
15228. Big Size Customize Clear Quartz Wafer Carrier Transparent Silica Boat for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Customize Clear quartz wafer carrier for semiconductor: The clear quartz wafer carrier softening point temperature is 1730 degree and the transparent quartz boat can be used at 1200 degree for long time and the short ...
15229. Purity Customize Circular Froty Fused Silica Wafer Quartz Glass Plate for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Customize Circular Frosty Fused Silica wafer Quartz glass plate for semiconductor: Coating of frosty qiartz quartz plate : high anti-UV film, antireflective film, gold, aluminum, silver series quartz glass and quartz ...
15230. Both Sides Grind Customize Frosty Fused Silica Quartz Glass Flange for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Both sides grind Customize Frosty Fused Silica Quartz Glass Flange for semiconductor Processing technology of frosty quartz glass flange: both sides grind, one side grind The purity of frosty silica quartz flange is ...
15231. Circular Customize Silica Glass Plate Frosty Fused Quartz Wafer for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Circular Customize silica glass plate Frosty Fused Quartz Wafer for semiconductor: Frosty quartz wafer can resist 1100 degree and both sides is grinded. Frosty silica quartz plate is with excellent thermal stability ...
15232. Purity Customize Flame Polishing Clear Fused Silica Quartz Glass Flange for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Customize flame polishing Clear Fused Silica Quartz Glass Flange : Clear silica quartz glass flange is widely used in electric light source, electrical appliances , semiconductor, Solar, optical communications, ...
15233. Small Size Purity Customize Frosty Fused Silica Quartz Glass Rod for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Small Size Customize Frosty Fused Silica Quartz Glass Rod for semiconductor: The frosty quartz glass rod ends is cut squiare and it also can be polish. Thie frosty fused quartz rod is mainly used as semiconductor ...
15234. Purity Customize Square Clear Fused Silica Tubing Quartz Glass Tube for Semiconductor [Mar 31, 2026]
[Mar 31, 2026] Customize Square Clear fused silica Quartz Glass Tube: There are two processing technology to produce the square clear quartz tube, one is open mold to produce and one is welding four pieces quartz plate together. And ...
15235. Advanced High-Precision Wafer Stacking Die Bonder for Semiconductors [Mar 31, 2026]
[Mar 31, 2026] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
15236. Precision Semiconductor Welding Rotator with UV Shielding Technology [Mar 23, 2026]
[Mar 23, 2026] Product Introduction The self-adjusting roller frame is a cutting-edge welding auxiliary equipment that ingeniously adapts the spacing of rollers to accommodate varying diameters of workpieces. Featuring a modular ...
15237. High Efficiency Gravity Die Casting Machine for Semiconductor Parts [Mar 26, 2026]
[Mar 26, 2026] Gravity Die Casting Machine for Auto Aluminum / Brass Parts casting Product Description 0-90°tilting gravity casting machine, it uses for pouring aluminum ,copper or brass products for auto parts or others ...
15238. Precision CNC Machining Services for Semiconductor and Robotics Industries [Mar 21, 2026]
[Mar 21, 2026] Product Description CNC MACHINING SERVICE High Precision Machining Capabilities: Unlock the full potential of your projects with the unparalleled excellence of our custom CNC parts machining service. Elevate your ...
15239. High-Performance Flip Chip Die Bonder for Semiconductor Efficiency [Feb 28, 2026]
[Feb 28, 2026] Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Category Specification Model SHD8120 Loading Method Wafer stacking and tray Bonding Method Epoxy Bonding Precision X/Y ≤ ...
15240. High Precision LED Die Bonding Machine for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
