Jiangsu Profile
Product List
18001. Quality Assurance SUS Bladed Alumina Oxide Al2O3 Ceramic Parts for Semiconductor Industry 
[Oct 12, 2024]
[Oct 12, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18002. Industrial Argon Gas Generator Manufacturer/High-Purity Gas Separation Equipment for Welding & ... [May 20, 2025]
[May 20, 2025] Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...
18003. Sinker EDM /Spark Eroded Titanium Coating Tungsten Carbide Mold Dies for Semiconductor [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18004. Sodick Sebu Wire-Cutting Mirror Surface CNC Machining Mold Part for Semiconductor Industry [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18005. Semiconductor High Precision COB Smart Die Bonding Machine [Oct 07, 2023]
[Oct 07, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18006. Semiconductor Die Bonding Machine China Manufacturer [Sep 27, 2023]
[Sep 27, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18007. High End Die Bonder Equipment to Assist in Semiconductor Packaging [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18008. Bozhon Semiconductor Die Bonding Machine [Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18009. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18010. Semiconductor Wafer Carrier95% 99% Alumina Ceramic Disk and Ceramic Edge Ring [Mar 11, 2025]
[Mar 11, 2025] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18011. Custom Made CNC Machining Milling Molding Zro2 Zirconium Oxide Ceramic Parts for Semiconductor ... [Oct 07, 2024]
[Oct 07, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18012. High Precision Optical Profile Grinding Opg Progressive Die Metal Stamping Dambar Cutting Die for ... [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18013. Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts [May 17, 2024]
[May 17, 2024] Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...
18014. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18015. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
