Jiangsu Profile
Product List
21901. High Precision Eutectic Machine for Semiconductor Chips 
[Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21902. Semiconductor Fully Automatic Optical Testing Equipment [Nov 28, 2023]
[Nov 28, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21903. Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21904. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21905. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21906. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21907. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21908. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21909. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21910. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21911. Customized CNC Machined Parts Semiconductor PCB Base Plate Precision Metal Parts [Nov 27, 2023]
[Nov 27, 2023] Wuxi Gemte Main Services -- Manufacture precision custom machining parts according to your drawings or designs Design, Manufacture, and After services of precision cold stamping mold parts and injection mold ...
Company: Wuxi Gemte Technology Co., Ltd.
21912. OEM ODM CNC Machining Machinery Machinery Part Stainless Steel Semiconductor Machinery Machinery ... [Sep 02, 2022]
[Sep 02, 2022] Product Description Product Description OEM Precision CNC Parts CNC Metal Processing Machinery Parts Our Advantage: 1) Competitive factory price directly. 2) Low MOQ (1pcs rapid prototype samples available!). ...
21913. Factory Wholesale Safety Semiconductor " Lubricating Oil" Container Printing Machine [Jul 26, 2022]
[Jul 26, 2022] Product Description Pad printers and screen printers suitable for printing in plastic rubber, metal glass, ceramic wood products and other materials, widely used in glass cosmetics, stationery office supplies, ...
21914. Nice Appearance Transparent Quartz Boat for Semiconductor Used [Feb 21, 2020]
[Feb 21, 2020] Specifications 1, different size quartz boat 2, purity 99.99% min 3, Resistance 1100 degree 4, Low OH 5, Nice Appearances Quartz boat 1, quartz boat: 2, purity 99.99% min 3, Resistance 1100 degree, 1000 ...
21915. OEM Vacuum Carburized Striking Box Ring Wrench for Semiconductor Manufacturing [Apr 15, 2025]
[Apr 15, 2025] size 22mm 41mm 80mm 120mm 24mm 46mm 85mm 125mm 27mm 50mm 90mm 130mm 30mm 55mm 95mm 135mm 32mm 60mm 100mm 140mm 34mm 65mm 105mm 145mm 36mm 70mm 110mm 150mm 38mm 75mm 115mm 155mm ...
Company: Jiangsu Ruida Tools Co., Ltd.
