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31996. Plastic Round PVDF Rod Tube for Medical and Semiconductor Applications 
[Sep 23, 2025]
[Sep 23, 2025] Product Description Material Brand Size (Rod) Services Application PVDF kynar 9000HD /1000HD MBH Dia. 4 /5/6/7/8/9/10/13/16/18/22/ 25/26/40/45/50/55/60/65/70/75 /80/85/90/95/100/120/170/230/260 or ...
Company: Nantong Kt New Materials Co., Ltd.
31997. Premium Plastic Round PVDF Rod Tube for Medical and Semiconductor Fields [Sep 23, 2025]
[Sep 23, 2025] Product Description Material Brand Size (Rod) Services Application PVDF kynar 9000HD /1000HD MBH Dia. 4 /5/6/7/8/9/10/13/16/18/22/ 25/26/40/45/50/55/60/65/70/75 /80/85/90/95/100/120/170/230/260 or ...
Company: Nantong Kt New Materials Co., Ltd.
31998. 1L Semiconductor Preparation High -Pure Hf Acid Purification System [Feb 21, 2024]
[Feb 21, 2024] Company Profile Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent ...
31999. IC Wafer Thinning Machine for Semiconductor Processing [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32000. Semiconductor Silicon Wafer Grinding Machine for Clean Surface [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32001. Semiconductor Silicon Wafer Thinning Machine High Precision [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32002. Semiconductor Silicon Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32003. Semiconductor Silicon Wafer Thinning Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32004. Semiconductor Wafer Double Side Lapping Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32005. Semiconductor Silicon Wafer Thinning Equipment Supplier [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32006. Semiconductor Silicon Wafer Double Side Grinding Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32007. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32008. Semiconductor Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32009. Semiconductor Silicon Wafer Lapping Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
32010. Semiconductor Silicon Wafer Grinding and Thinning Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
