Jiangsu Profile
Product List
36991. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment 
[Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36992. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36993. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36994. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36995. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36996. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36997. Semiconductor Wall Systems, Non-Progressive Cleanroom Honeycomb Panels [Apr 15, 2023]
[Apr 15, 2023] General Information Aluminum honeycomb panel is sandwich panel bonded with aluminium face material and with a core in aluminium honeycomb. It offers high mechanical properties and good fire performances. The aluminum ...
Company: Kunshan Bihore Honeycomb Materials Technology Co., Ltd.
36998. Custom Injection Molding Plastic Parts with Advanced Peek Semiconductor Material [Sep 24, 2025]
[Sep 24, 2025]
36999. Advanced Injection Molding with Precision Peek Semiconductor Material [Sep 08, 2025]
[Sep 08, 2025]
37000. Custom Peek Semiconductor Mould Parts for Precision Applications [Sep 08, 2025]
[Sep 08, 2025]
37001. Advanced Plastic Injection Mould Solutions with Premium Peek Semiconductor Material [Sep 08, 2025]
[Sep 08, 2025] Precision PEEK Semiconductor Material for Advanced Molding Solutions Custom Mold & Injection Embark on a seamless journey from concept to creation as we manufacture a mold, inject molten plastic into it, and let it ...
37003. Antistatic and Antibacterial Semiconductor Conveyor Belt for Clean Environments [Sep 08, 2025]
[Sep 08, 2025]
37004. High-Temperature Resistant PP Conveyor Belt for Semiconductor Manufacturing [Sep 08, 2025]
[Sep 08, 2025]
37005. Custom Thickness POM Conveyor Belt for Semiconductor Equipment Use [Sep 08, 2025]
[Sep 08, 2025]
