Jiangsu Profile
Product List
14326. Manual Operation Fluorine Lined Butterfly Semiconductor Valve Wcb Wafer Soft Sealed Acid Alkali Mfr ... 
[Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14327. Soft Sealed Centerline Butterfly Semiconductor Valve Manual Wcb Wafer Type Fluorine Lined for Acid ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14328. Factory Supply Manual Butterfly Semiconductor Valve Wcb Wafer Soft Sealed Fluorine Lined for ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14329. Customized Industrial Grade Butterfly Semiconductor Valve Manual Wcb Fluorine Lined Wafer Soft ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14330. Ultra-High Temperature Alumina Fiber Needled Blanket 1600º C for Semiconductor Furnace [Apr 06, 2025]
[Apr 06, 2025] A) How could I get a sample? Before we received the first order, please afford the sample cost and express fee. We will return the sample cost back to you within your first order. B) Is custom production supported? ...
Company: Jiangsu Aladdin High Temperature Materials Co., Ltd.
14331. Nai-Lok Hastelloy C276 Ultra High Purity Manual Butt Weld Bellows Valve for Semiconductor [Dec 03, 2024]
[Dec 03, 2024] Product Name The simplified actuator design makes it more compact Excellent finish level of wetted areas with NAI-LOK own electro polish precess Specification 316L SS material for ultra-pure,flammable,or toxic fluid ...
14332. Corrosion Resistant Pneumatic Diaphragm Pump for Food, Chemical, Pharmaceutical, Semiconductor, ... [Dec 02, 2025]
[Dec 02, 2025] HCMAG Product Introduction Pneumatic Diaphragm Pump Product Brief 1. It can pump flowing liquid as well as convey some mediums which are not easy to flow, and has many advantages of self-priming pumps, submersible ...
14333. Semiconductor Engineering Plastic Corrosion Resistant Pure Water Magnetic Circulation Pump [Dec 02, 2025]
[Dec 02, 2025] HCMAG Product Introduction GMX Series Product Brief ETFE+CF,PP+GF 18 models with flow rates up to 1350 L/Min and discharge head of 4lm Able to handle many types of chemical and temperature up to ...
14334. Advanced Semiconductor Oven with Precision Temp and Humidity Control [Dec 13, 2025]
[Dec 13, 2025] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
14335. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
14336. Advanced High Precision Die Bonder for Semiconductor Packaging [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
14337. Fully Automatic Semiconductor Molding System with Easy Mold Swapping [Dec 13, 2025]
[Dec 13, 2025] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
14338. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
14339. Fully Automatic Die Bonding Machine for Advanced Semiconductor Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
14340. Reliable High Low Temperature Humidity Test Chamber for Semiconductor, Aerospace, Environmental ... [Dec 05, 2025]
[Dec 05, 2025] High and low temperature test chamber scope of application The high and low temperature test chamber, also known as an environmental test chamber, is a device used to evaluate the performance of materials under ...
Company: Wuxi Marit Technology Co., Ltd
